SOLDERING VOIDS Search Results

AN10896

Contextual Info: AN10896 Mounting and Soldering of RF transistors Rev. 2 — 13 Nov 2012 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages

AN10896

Abstract: finger print sensor pcb with circuit Mounting and Soldering of RF transistors heller 1700 ipc 610D JEDEC J-STD-020d Moisture/Reflow sensitivity HVQFN48 J-STD-020D bga rework graphite thermal spreader
Contextual Info: AN10896 Mounting and Soldering of RF transistors Rev. 01 — 17 May 2010 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages

SP0101NZ1-2

Abstract: SP0101N EMKA Tablets DIAGRAM
Contextual Info: SiSonic Silicon Microphone TM Product Features SiSonic TM - Surface Mount Microphone - Compatible with Standard Surface Mount Soldering Process - Automated Pick 'n' Place Using Standard Equipment - No Off-Line Soldering or Insertion - Highly Shock Resistant

Cu3Sn

Abstract: Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN
Contextual Info: AN10365 Surface mount reflow soldering description Rev. 02 — 26 July 2006 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.

aluminium pop rivet

Abstract: to220 mica Soldering guidelines and SMD footprint design to220 torque for SELF TAPPING SCREW SC18 MGA768
Contextual Info: MOUNTING AND SOLDERING INSTRUCTIONS Page SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN FOR AXIAL AND RADIAL LEADED PACKAGES AND MEDIUMPOWER SURFACE MOUNT PACKAGES This information is contained in Philips publication SC18 Discrete Semiconductor Packages, 1997 , section: 4.

AN10365

Abstract: ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3
Contextual Info: AN10365 Surface mount reflow soldering description Rev. 04 — 13 August 2009 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and

Lead Free reflow soldering profile BGA

Abstract: AN10365 HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products
Contextual Info: AN10365 Surface mount reflow soldering description Rev. 01 — 24 May 2005 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.

Cu3Sn

Abstract: HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3 AN10365
Contextual Info: AN10365 Surface mount reflow soldering description Rev. 03 — 22 April 2008 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.

Cu3Sn

Abstract: ipc 610 non-wetting
Contextual Info: AN10365 Surface mount reflow soldering Rev. 6 — 30 July 2012 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and handling of NXP semiconductor packages.

Contextual Info: AN11183 Mounting and soldering of RF transistors in over-molded plastic packages Rev. 1 — 6 November 2012 Application note Document information Info Content Keywords Over-Molded Plastic OMP packages, heat sink, footprint, surface mount, reflow soldering, component handling, exposed heat spreader, SMDP,

Contextual Info: Automation Controls Catalog Partly To Be Discontinued Last time buy:September 30, 2013 For board-to-board For board-to-FPC Narrow pitch connectors 0.4mm pitch P4 Series FEATURES • Without soldering terminals m m 96 3. m 1m 5. Socket Header • With soldering terminals

IXAN0030

Abstract: solder voids to263 voids to263
Contextual Info: IXAN0030 Surface Mount Soldering Recommendations for TO-263 and TO-268 Case Styles The IXYS TO-263 and TO0268 surface mount packages have tinned terminals and bases to allow state-of-the- art SMD soldering. Due to the sizes of the packages, there are some

683-166

Abstract: 561101 electrical solvent cleaner rs-online 400ML MULTICORE SOLDER K1856
Contextual Info: Issued November 1994 K18562 Solder Introduction Soldering is an important part of the PCB manufacturing process. The most reliable components and the highest quality PCB manufacture do not counterbalance poor soldering. The correct choice of alloy, size and flux type, together with careful preparation and

Contextual Info: SOLDERING RECOMMENDATIONS for SMD IXYS surface mount devices SMD in TO 252 / TO 263 / TO 268 / - packages have tinned terminals and base to allow an similar soldering process like common SMD devices. Due to the size of the package and the power dissipated there are some special

AXK820125WG

Abstract: AXK770247G
Contextual Info: AXK7, 8 For board-to-board For board-to-FPC Narrow pitch connectors 0.4mm pitch P4 Series FEATURES • Without soldering terminals 96 3. m m m 1m 5. Socket Header • With soldering terminals 1. 0.4 mm pitch and mated heights of 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.5

AXK770327G

Abstract: FPC CONNECTOR Front lock
Contextual Info: AXK7, 8 For board-to-board For board-to-FPC Narrow pitch connectors 0.4mm pitch P4 Series FEATURES • Without soldering terminals 96 3. m m m 1m 5. Socket Header • With soldering terminals 1. 0.4 mm pitch and mated heights of 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.5

AXK880145WG

Abstract: AXK770247 AXK770327G AXK720247 AXK730347
Contextual Info: AXK7, 8 For board-to-board For board-to-FPC Narrow pitch connectors 0.4mm pitch P4 Series FEATURES • Without soldering terminals 96 3. m m m 1m 5. Socket Header • With soldering terminals 1. 0.4 mm pitch and mated heights of 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 3.5

QQ-S-571E

Abstract: 5082-7441 MIL-P-28809 QQS-571-E Kester sn62 tinning HDSP-6300 HDSP-6508 MIL-B-81705 Display hp 5082-7441 QQ-S571E
Contextual Info: Soldering LED Components Application Note 1027 Table of Contents • Introduction . 1 • An Abstract of Key Points . 2 • Leads on LED Components .

Contextual Info: Application Report SLTA054 – May 2005 – Revised August 2009 High-Temperature Soldering Requirements for Plug-In Power Surface-Mount Products . PMP - Plug-In Power

100 series machine screw SOCKET

Contextual Info: 3M PGA Socket Screw Machine 200 Series • Accepts various PGA packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Optional seal tape for closed-body configuration • Custom patterns available for quantities above

Contextual Info: 3M PGA Socket Screw Machine 200 Series ED • Accepts various PGA packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Optional seal tape for closed-body configuration • Custom patterns available for quantities above

100-014-0xx

Contextual Info: 3M DIP Socket Screw Machine 100 Series • Accepts various DIP packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Inner contact aligned to maximize contact surface area • Optional seal tape for closed-body configuration

3M DIP SOCKET

Contextual Info: 3M DIP Socket Screw Machine 100 Series • Accepts various DIP packages • Reliable four finger contact interface • Unique body design prevents air voids during soldering • Inner contact aligned to maximize contact surface area • Optional seal tape for closed-body

GE-MOV 275V

Abstract: SCR based induction furnace circuit diagram varistors* gemov 250v ge ecm 2.3 series motors 10J 3kv AN9771 micro switch leach 1480 Thyristor 1200 A, IDM SCR Unit, LSI 5350 Storage Enclosure AN9774
Contextual Info: Application Notes and Technical Brief 10 Transient Voltage Suppression PAGE AN8820.3 Recommendations for Soldering Terminal Leads to MOV Varistor Discs . . . . . . . . . . . . . . . . . . . 10-3 AN9108.4 Littelfuse “ML” Multilayer Surface Mount Surge Suppressors . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-4