SOLDER JOINT Search Results

GR-78-CORE

Abstract: J-STD-005 multicore solder paste GR78-CORE GR-78-CORE PCB solder powder J-STD-004 paste J-STD-004 MSDS bellcore GR-78 MCF800
Contextual Info: Technical Data Sheet MP200 Solder Paste February 2005 HIGH-SPEED PRINTING, NO-CLEAN SOLDER PASTE PRODUCT DESCRIPTION Multicore MP200 solder pastes have been formulated as no-clean solder pastes for high speed printing and reflow in both air and nitrogen. The products were specifically formulated to have increased

CU-106A

Abstract: entek plus cu 106a anova general cross references TI Cross Reference Search HC373 Au Sn eutectic gold embrittlement
Contextual Info: Pb-Free Solder Joint Evaluation Contact Us Buy About TI TI Worldwide my.TI Advanced Search Keyword Part Number >> Semiconductor Home > Products > Digital Logic > Digital Logic Overview > Texas Instruments Palladium Lead Finish Pb-Free Solder Joint Evaluation

c 6090

Abstract: IPC-A-610 k type thermocouple Thermocouple Type K oven 65psi
Contextual Info: Lead Free Solder Reflow Profile - SMD Trimpot Products Process Description Materials 1. Apply solder paste to test board 8 - 10 mil thick Temperature Time Interval • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Alloy water soluble or no clean solder paste

AN3025

Abstract: transistor working principle tinning METCAL MX-500 circuit free transistor SN62 SN63 GC Electronics 108109 metcal transistor free
Contextual Info: Application Note AN3025 Transistor Mounting and Soldering Rev. 3 Introduction There are three basic steps recommended to mount and solder RF power transistors into a circuit. Solder pre-tin the transistor leads Mount the transistor Solder the transistor leads to the circuit trace

JIS C7021

Abstract: JIS-C-7021 JIS C7021 B-10 JIS C 7021B-10 C7021A
Contextual Info: • Soldering Instructions Iron soldering with 1.5mm iron tip Dip and flow soldering Types Temperature of the soldering bath Maximum soldering time Distance from solder joint to case Temperature of soldering iron Maximum soldering time Distance from solder joint

land pattern ssop28

Abstract: SO18W IPC-SM-782 SSOP-20 land pattern so18w SSOP20 LAND PATTERN
Contextual Info: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder

C 6090

Abstract: g10 smd transistor SMD g10 Water soluble water soluble cleaning reflow profile 245 solder paste
Contextual Info: Lead Free Solder Reflow Profile - SMD Trimmers Process Description 1. Apply solder paste to test board 8 - 10 mil thick Materials Time Interval Temperature • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Alloy water soluble or no clean solder paste (see note 1)

Contextual Info: 新製品紹介 実装接合用Cuコア鉛フリーはんだボール Cu Cored Pb-Free Solder Ball for Solder Jointing Cu cored Pb-free solder ball：CNSA3A5C, CNSAC タブレット端末に代表されるよう めっきが均一に施されており滑らか

AIMTERGE-520A

Abstract: SN100C C425 BI14
Contextual Info: RA Cored Wire Solder Rosin Activated Cored Wire Solder Features: - High Activity Level - Good Thermal Transfer - Fully Activated Flux - Glycol-Free - Improved Wetting Properties Description: RA is a fully activated, general-purpose wire solder for use in applications where mildly activated fluxes are too weak. RA

multicore solder wire

Abstract: henkel solder Loctite multicore multicore solder J-STD-006 Water soluble flux Loctite multicore solder wire
Contextual Info: Technical Data Sheet Multicore“ Hydro-X September 2007 HIGH ACTIVITY WATER SOLUBLE CORED SOLDER WIRE Properties of Multicore Hydro-X solid flux cored solder wires: x Rapid soldering of most difficult to solder parts x Fast wetting x Water washable, no need for added neutralisers

Contextual Info: Surface mount sockets for 1C packages! These unique sockets have sic tted tails to provide added adhesion to the solder paste and greater solder joint strength. The high tempers ture LCP body is ideal for vapor phase or infrared soldering. Precision stamped

Contextual Info: F-205-1 sam Tec CHIP CARRIER SOCKETS PLCC SERIES FEATURES • Same footprint as most common plastic leaded chip carriers. • Unique PLCC Series contact design has a “slotted tail" for added adhesion of solder paste, and superior solder joint strength. PLCC

J-STD-006 electronic grade solder alloys

Abstract: TC-527 ASTM B32 4662-SM QQ-S-571F kester 245 solder wire Kester sn62 tinning RV8NA nte semiconductors ceiling fan
Contextual Info: E L E C T R O N I C S, I N C. www.nteinc.com Kester Solder Wide range of solders and related materials from the leader in the industry. Products KESTER • Wire Solder • Bar Solder • Carded & Counter Display Products • Chemicals • Techform Products

Contextual Info: F -2 0 4 SURFACE MOUNT DIP SOCKET SERIES Surface mount sockets for 1C packages! These unique sockets have slotted tails to provide added adhesion to the solder paste and greater solder joint strength. The high temperature LCP body is ideal for vapor phase or

37803

Abstract: TS-2271-C 37204-1BEO-004 37204-1AE0-004
Contextual Info: 3M Mini-Clamp Socket 2 mm, Surfacemount, Right Angle 372 Series • Low profile design minimizes overall thickness • Compact design saves board space • Multiple PCB locating post layouts to ensure competitive compatibility • Solder tab design helps ensures a reliable solder joint

Contextual Info: Features and Benefits a B H B Size 20 circuits Low profile, 2.60mm seating plane height above PCB Full SMT design for pick-and-place application . In-line solder tail offers single-side processing, easy inspection and rework B 1 " lead provides stronger solder joints

37204-1AE0-004

Contextual Info: 3M Mini-Clamp Socket 2 mm, Surfacemount, Right Angle 372 Series • Low profile design minimizes overall thickness • Compact design saves board space • Multiple PCB locating post layouts to ensure competitive compatibility • Solder tab design helps ensures a reliable solder joint

IC26V-0603-GG4

Contextual Info: IC26V Series DIP 2.54mm Pitch Features w m x v -7 ti\ & a ,/ cs y ^ ' y ^ x < D m x ^ m ± RoHSJt^*MS Highly reliable four-point contact design Machined sleeves eliminating solder or flux penetration Stand-off preventing blowholes in solder joints RoHS compliant

cloverleaf

Abstract: Clover 011-6809-040209 20swg 011-6808-040209
Contextual Info: 6q CLOVERLEAF FEED-THROUGHS The Press-Fit Cloverleaf Receptacle provides economical, yet uniform ly perfect solder joints by means of dip soldering with metal chassis. The unique Cloverleaf configuration permits insertion of four or more wire leads. The reliability of dip solder joints made with the Cloverleaf

Contextual Info: FACTSHEET F-199 amtec ICF SURFACE MOUNT DIP SOCKETS SERIES Surface m ount sockets fo r 1C packages! These unique sockets have slotted tails to provide added adhesion to the solder paste and greater solder joint strength. The high temperature LCP body is ideal for vapor phase or

Contextual Info: page 1/5 Surface Mount Terminal Blocks 971-SLR-THR-1.1 | 5.00 mm 0.197 in Spacing - 2-12 poles PICTURES 971-SLR-THR-1.1 TECHNICAL INFORMATION Description Standoffs underneath the molding prevent bottom of molding from touching the solder paste and allow for a visual inspection of the solder joints and

Cu6Sn5

Abstract: Cu6Sn5 surface energy sem 2006 IPACK2005
Contextual Info: APPLIED PHYSICS LETTERS 88, 012106 ͑2006͒ Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints Lingyun Zhang,a͒ Shengquan Ou, Joanne Huang, and K. N. Tu Department of Materials Science and Engineering, University of California, Los Angeles,

TC-2419

Abstract: TC-527 TC-447 TC-527HB LB 2 resin compound TC-564-1 Tc 521 A latex TC530
Contextual Info: Techform Products E L E C T R O N I C S, I N C. Temporary Solder Masks and Adhesives are now available through Kester's Techform line. The solder masks are applied to printed circuit boards to prevent solder from flowing onto edge connectors, gold fingers, or empty through-holes. The adhesives are designed to form a bond that will maintain

FAY RF

Contextual Info: Development General NXP Semiconductors BL-Cellular Systems, MST RF Power Basestations DEV&QAS Title: Solder mounting recommendations for Ldmos Power Amplifiers Author: Josselin FAY / Raimond DUMOULIN Doc. Nr. Date: 2007/05/10 General solder mounting recommendations