SOFT SOLDER DIE BONDING Search Results

defibrillator

Abstract: MSAGA11F120D MSAGA11F120DL
Contextual Info: N-Channel enhancement mode high density IGBT die Passivation: Polyimide, 20 um, over Silicon Nitride, .8um Emitter Metallization: Al/1%Si for aluminum wire bonding, 3.2 um typical. • Collector/Gate Metallization: Ti – Ni 1 um – Ag (0.2 um) for soft solder attach

ultrasonic bond

Abstract: schematic WELDER Gunn Diode schematic WELDER capacitor M541 varactor beam lead thermal conductive teflon mesa similar
Contextual Info: Application Note M an A M P com pany Bonding and Handling Procedures for Chip Diode Devices M541 V 2.00 Discussion Microstrip Packages and Chip Carriers Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last

schematic WELDER

Abstract: gold melting furnace ultrasonic bond
Contextual Info: Bonding and Handling Procedures for Chip Devices DISCUSSION Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last few years. Today's circuit designer is faced with a multiplicity of alter­ natives in the selection of diodes and packaging with each

MSTF-2ST-10R00J-G

Abstract: Au Sn eutectic M570 bond wire gold soft solder die bonding 84-1LMI
Contextual Info: Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMIC’s Discussion Millimeterwave MMIC's are becoming more common in commercial applications. Their small size and potentially lower cost has made them valuable in the growing market of millimeterwave systems. Their size and delicate nature

PIN diode MACOM SPICE model

Abstract: macom pin diode application
Contextual Info: MA4SPS302 SURMOUNTTM PIN Diode RoHS Compliant Rev. 3 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ MA4SPS302 Surface Mount No Wire Bonding Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance

MA4SPS302

Contextual Info: MA4SPS302 SURMOUNTTM PIN Diode RoHS Compliant Rev. V4 Features •        MA4SPS302 Surface Mount No Wire Bonding Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection

PIN diode ADS model

Abstract: HP4291A M541 MA4SPS302
Contextual Info: MA4SPS302 SURMOUNTTM PIN Diode RoHS Compliant Rev. V3 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ MA4SPS302 Surface Mount No Wire Bonding Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance

LND1

Contextual Info: LND1 Die Specifications LND1 G D S Backside: Source All dimensions in mils. Bonding Pads3 Dimensions Recommended Assembly Material 2 Die Geometry Length1 Width LND1 30 30 Thickness 11 ± 1.5 Backside Metal Au Material Al-Si Notes: 1. Maximum values 2. Standard Au back is alloyed for optimum eutectic die attach. Ag backing is optional.

VF06S

Abstract: vf06
Contextual Info: VF06 Die Specifications VF06 S G Backside: Drain All dimensions in mils. Bonding Pads3 Dimensions Recommended Assembly Material 2 Die Geometry Length1 Width VF06 70 50 Thickness Backside Metal Material Size Wire4 Wire Size4 Preform5 11 ± 1.5 Au Al-Si 8 x 15

VF25

Contextual Info: VF25 Die Specifications VF25 G S Backside: Drain All dimensions in mils. Bonding Pads3 Dimensions Recommended Assembly Material 2 Die Geometry Length1 Width VF25 45 45 Thickness Backside Metal Material Size Wire4 Wire Size4 Preform5 11 ± 1.5 Au Al-Si 6.4 x 6.6

soft solder die bonding

Abstract: die bond VF-03 eutectic
Contextual Info: Die Specifications VF03 G S All dimensions in mils. Bonding Pads3 Dimensions Recommended Assembly Material 2 Die Geometry Length1 Width VF03 146 118 Thickness Backside Metal Material Size Wire4 Wire Size4 Preform5 11 ± 1.5 Au Al-Cu-Si 15 x 20 Al 5 Au-Si Eutectic

VF01

Contextual Info: VF01 Die Specifications VF01 S G Backside: Drain All dimensions in mils. Bonding Pads3 Dimensions Recommended Assembly Material 2 Die Geometry Length1 Width VF01 42 42 Thickness Backside Metal Material Size Wire4 Wire Size4 Preform5 11 ± 1.5 Au Al-Si 5x5

VF21

Abstract: bond wire Ag
Contextual Info: VF21 Die Specifications VF21 S G Backside: Drain All dimensions in mils. Bonding Pads3 Dimensions Recommended Assembly Material 2 Die Geometry Length1 Width VF21 30 30 Thickness Backside Metal Material Size Wire4 Wire Size4 Preform5 9 ± 1.5 Au Al-Si 6 x 5.5

VF13

Contextual Info: VF13 Die Specifications VF13 S G Backside: Drain All dimensions in mils. Bonding Pads3 Dimensions Recommended Assembly Material 2 Die Geometry Length1 Width VF13 30 30 Thickness Backside Metal Material Size Wire4 Wire Size4 Preform5 11 ± 1.5 Au Al-Si 4x4

ausi die attach

Contextual Info: LP07 Die Specifications LP07 G D Backside Potential: Drain6 All dimensions in mils. Bonding Pads3 Dimensions Recommended Assembly Material 2 Die Geometry Length1 Width LP07 50 70 Thickness 11 ± 1.5 Backside Metal None Material Al-Si Notes: 1. Maximum values

VF21

Abstract: VF21/VF31
Contextual Info: VF21 VF31 Die Specifications VF21 / VF31 S G Backside: Drain All dimensions in mils. Bonding Pads3 Dimensions Recommended Assembly Material 2 Die Geometry Length1 Width VF21/VF31 30 30 Thickness Backside Metal Material Size Wire4 Wire Size4 Preform5 9 ± 1.5

VF25

Abstract: eutectic
Contextual Info: VF25 VF35 Die Specifications VF25 / VF35 G S Backside: Drain All dimensions in mils. Bonding Pads3 Dimensions Recommended Assembly Material 2 Die Geometry Length1 Width VF25/VF35 45 45 Thickness Backside Metal Material Size Wire4 Wire Size4 Preform5 11 ± 1.5

Contextual Info: LNE1 Die Specifications LNE1 G D S Backside: Source All dimensions in mils. Bonding Pads3 Dimensions Recommended Assembly Material 2 Die Geometry Length1 Width LNE1 30 30 Thickness 11 ± 1.5 Backside Metal Au Material Al-Si Notes: 1. Maximum values 2. Standard Au back is alloyed for optimum eutectic die attach. Ag backing is optional.

eutectic

Contextual Info: VF53 Die Specifications VF53 G S Backside: Drain All dimensions in mils. Bonding Pads3 Dimensions Recommended Assembly Material 2 Die Geometry Length1 Width VF53 30 56 Thickness 8 ± 1.0 Backside Metal Au Material Al/Si Notes: 1. Maximum values 2. Standard Au back is alloyed for optimum eutectic die attach. Ag backing is optional.

VF22

Contextual Info: VF22 Die Specifications VF22 G S Backside: Drain All dimensions in mils. Bonding Pads3 Dimensions Recommended Assembly Material 2 Die Geometry Length1 Width VF22 105 70 Thickness 11 ± 1.5 Backside Metal Au Material Al-Si Notes: 1. Maximum values 2. Standard Au back is alloyed for optimum eutectic die attach. Ag backing is optional.

Contextual Info: VF26 Die Specifications VF26 S G Backside: Drain All dimensions in mils. Bonding Pads3 Dimensions Recommended Assembly Material 2 Die Geometry Length1 Width VF26 70 70 Thickness Backside Metal Material Size Wire4 Wire Size4 Preform5 11 ± 1.5 Au Al-Si 4 x 6.25

soft solder die bonding

Contextual Info: VF32 Die Specifications VF32 S G Backside: Drain All dimensions in mils. Bonding Pads3 Dimensions Recommended Assembly Material 2 Die Geometry Length1 Width VF32 55 55 Thickness 11 ± 1.5 Backside Metal Au Material Al/Si Notes: 1. Maximum values 2. Standard Au back is alloyed for optimum eutectic die attach. Ag backing is optional.

Contextual Info: VF05 Die Specifications VF05 G S Backside: Drain All dimensions in mils. Bonding Pads3 Dimensions Recommended Assembly Material 2 Die Geometry Length1 Width VF05 43 41 Thickness Backside Metal Material Size Wire4 Wire Size4 Preform5 11 ± 1.5 Au Al-Si 5x5

MADP-000502-12700P

Abstract: PIN diode ADS model MA4SPS502 PIN attenuator ADS model diode ADS model
Contextual Info: MA4SPS502 SURMOUNTTM PIN Diode Rev. V2 Features •        Case Style Outline Drawing ODS-12701,2 Surface Mount Device No Wire Bonding Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection