SO8 PACKAGE Search Results

TM 1628 driver display

Abstract: LD1117 equivalent ST2052 LNBP21 LNBH21 ST2042 diseqc 2.0 vfd controller ST8004 LD1117
Contextual Info: Audio drivers for headphone output Operating temp ºC Part number TS482 TS486 TS487 Supply voltage Vcc V Package -40 to 85 -40 to 85 -40 to 85 Voltage regulators SO8 - Mini SO8 - DFN8 SO8 - Mini SO8 - DFN8 SO8 - Mini SO8 - DFN8 Input channels 2 to 5.5 2 to 5.5

LPC2000

Abstract: LPC908 P89LPC908 measurement of power using 8051 microcontroller schematic usb flash
Contextual Info: DB-SO8-LPC908 USB-Dongle and Derivative Boards The DB-SO8-LPC908 is the Derivative Board for the P89LPC908 microcontroller in an 8 pin SO package. The DB-SO8-LPC908 requires the use of the USB-Dongle for power and a programming interface. The USB-Dongle and DB-SO8-LPC908 allow quick and easy ICP

LPC2000

Abstract: LPC908 P89LPC908 622-1015-ND
Contextual Info: DB-SO8-LPC908 USB-Dongle and Derivative Boards The DB-SO8-LPC908 is the Derivative Board for the P89LPC908 microcontroller in an 8 pin SO package. The DB-SO8-LPC908 requires the use of the USB-Dongle for power and a programming interface. The USB-Dongle and DB-SO8-LPC908 allow quick and easy ICP

HTQFP100

Abstract: LQFP48 HBCC32 DB4042 CGY2110 TZA3001 TZA3013 TZA3023 TZA3031 TZA3033
Contextual Info: MSD818 Philips Semiconductors Input Fiber Optic Interface ICs Line Card Part number Datarate Mb/s Package Type Bare Die TRANSIMPEDANCE AMPLIFIERS TZA3033 TZA3023 TZA3043 TZA3013 CGY2102 CGY2110 CGY2140 155 622 1250 2488 3250 10700 39813 SO8 SO8 SO8 HVQFN24

LQFP48

Abstract: cgy2141 LQFP32 TZA3013 TZA3023 TZA3033 TZA3043 TZA3012 CGY2151
Contextual Info: Philips Semiconductors Input Fiber Optic Interface ICs Line Card Part Number Datarate Mb/s TRANSIMPEDANCE AMPLIFIERS TZA3033 155 TZA3023 622 TZA3043 1250 TZA3013 2488 CGY2102 3250 CGY2110 9953 CGY2140 39813 Package Type SO8 SO8 SO8 - Bare Die X X X X X X X

Contextual Info: PTC04-TestBench-90316 Socket utility to connect to PTC-programmer Features and Benefits Utility to make first magnetic evaluations 90316 SO8, TSSOP16 90324 SO8, TSSOP16 90333 SO8, TSSOP16 90360 SO8 Easy to modify or make own socket board Applications Additional utility for PTC04 in order to easy connect devices

PESD5V0L6US

Abstract: 5v0l6us
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET PESD5V0L6US Low capacitance 6-fold ESD protection diode array in SO8 package Product specification 2004 Feb 18 Philips Semiconductors Product specification Low capacitance 6-fold ESD protection diode array in SO8 package

hf2c

Abstract: TS934 m1 sot23 TS931 TS932 TS93X TSSOP14 transistor st 932
Contextual Info: Q093XC1 ST Microelectronics GRENOBLE PLANT Standard Linear ICs, DSG SHORT QUALIFICATION REPORT LINE : 093X PRODUCT NAME : TS93X LINE DESCRIPTION : MICROPOWER OPERATIONAL AMPLIFIER WAFER CODE : 093XAAH PACKAGES : TS931 : SO8 / SOT23-5 TS932 : SO8 / DIP8 TS934 : SO14 / DIP14 / TSSOP14

Contextual Info: SEA01 Constant voltage and current controller with online digital trimming Datasheet - production data • Redundant OTP first and second trimming • Extended operating voltage range • Very low quiescent current • Offered in an SO8 package SO8 Applications

M24C16K

Abstract: Nitto MP8000 QREE0016 Nitto MP8000 601 so8
Contextual Info: QREE0016 QUALIFICATION REPORT MP8000 Mold Compound SO8 Shenzhen THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify new Nitto Mold Compound called MP8000 used on SO8 package Small Outline Package in Shenzhen plan. This

SO8 package

Contextual Info: Philips Semiconductors Product data SO8: plastic small outline package; 8 leads; body width 3.9 mm pin 1 index B2 1.73 4.95 4.80 0.51 0.33 0.068 0.189 0.195 0.013 0.020 SO8 4.95 4.80 1.27 0.38 0.076 0.050 0.015 0.003

076E03

Abstract: MARKING SO8
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET PESD5V0L7BS Low capacitance 7-fold bi-directional ESD protection diode array in SO8 package Product specification 2004 Mar 15 Philips Semiconductors Product specification Low capacitance 7-fold bi-directional ESD protection diode array in SO8 package

Contextual Info: STEVAL-CCA036V1 Demonstration board for single channel op-amp in SO8 package Data brief Description The STEVAL-CCA036V1 demonstration board is designed to help characterize single operational amplifiers in SO8 packages. With this board, the most common op-amp based

OF TL084 OPAMP

Abstract: audio Amp. mosfet 1000 watt 3000 Watt BTL Audio Amplifier AUDIO AMPLIFIER 140 WATT MOSFET 24v 5 amp smps TDA2320A replacement DC MOTOR DRIVE WITH LM324 NE555 IGBT DRIVER TSM1001 lm336 sot23
Contextual Info: Standard linear portfolio From innovative devices to application specific products Package Flip chip DFN8 Mini SO8 SO8 S014/16 SO20 SO24 batwing SOT23-3/5 TO92 TQFP44/48 TSSOP8 TSSOP14/16 TSSOP28 Tape width mm Qty/reel (min.order qty) Lead-free available

Contextual Info: Package Drawings SOIC and TSOP Packages - SO8, VO8 10-24 November 13, 1997 Version 1.2

VFQFPN8* footprint

Abstract: so8 pcb pattern VFQFPN8 MLP8 FOOTPRINT mlp8 land pattern VFQFPN land pattern M25PXX SO8 NARROW so8 footprint AN1579
Contextual Info: AN1579 APPLICATION NOTE Compatibility between the SO8 Package and the MLP Package for the M25Pxx in Your Application CONTENTS • FITTING MORE IN THE SAME AREA – Cross sections of the MLP and SO8 ■ ■ The new MicroLeadframe Package MLP is the ideal solution

Contextual Info: M24SR64-Y Dynamic NFC/RFID tag IC with 64-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • TSSOP8 ECOPACK®2 • UFDFPN8 ECOPACK®2

Contextual Info: M24SR02-Y Dynamic NFC/RFID tag IC with 2-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • TSSOP8 ECOPACK®2 • UFDFPN8 ECOPACK®2

Contextual Info: M24SR02-Y Dynamic NFC/RFID tag IC with 2-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - preliminary data Package • 8-lead small-outline package SO8 ECOPACK 2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • TSSOP8 ECOPACK®2 • UFDFPN8 ECOPACK®2

Contextual Info: M24SR16-Y Dynamic NFC/RFID tag IC with 16-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - preliminary data Package • 8-lead small-outline package SO8 ECOPACK 2 • TSSOP8 ECOPACK®2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • UFDFPN8 ECOPACK®2

Contextual Info: M24SR64-Y Dynamic NFC/RFID tag IC with 64-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - preliminary data Package • 8-lead small-outline package SO8 ECOPACK 2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • TSSOP8 ECOPACK®2 • UFDFPN8 ECOPACK®2

Contextual Info: M24SR16-Y Dynamic NFC/RFID tag IC with 16-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 • TSSOP8 ECOPACK®2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • UFDFPN8 ECOPACK®2

Contextual Info: M24SR64-Y Dynamic NFC/RFID tag IC with 64-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • TSSOP8 ECOPACK®2 • UFDFPN8 ECOPACK®2

QREE0025

Abstract: 6 mil poly M24256N
Contextual Info: QREE0025 QUALIFICATION REPORT SO8 ASE Assembly Plant Transfer from Taïwan to Philipines THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify the transfert of the assembly plant of our subcontractor ASE from Taïwan to Philipines for SO8 package Small Outline