SO16 JEDEC Search Results

ULQ2003

Abstract: 2004D1
Contextual Info: ULQ2001 ULQ2003 - ULQ2004 Seven Darlington array Features • Seven Darlington per package ■ Extended temperature range: -40 to 105 °C ■ Output current 500 mA per driver 600 mA peak ■ Output voltage 50 V ■ Automotive Grade product in SO16 package

Contextual Info: ST7LNB0V2Y0 DiSEqC 2.1 slave microcontroller for LNBs and switchers Features • ■ Clock, reset and supply management – Reduced power consumption. – Safe power on/off management by low voltage detector LVD . – Internal 8 MHz oscillator SO16 narrow

AN2035

Abstract: AN2036 diseqc 2N2222 AN1015 AN1181 AN1709 IEC1000-4-2 ST7LNB0V2Y0
Contextual Info: ST7LNB0V2Y0 DiSEqC 2.1 slave microcontroller for LNBs and switchers Features • ■ Clock, reset and supply management – Reduced power consumption. – Safe power on/off management by low voltage detector LVD . – Internal 8 MHz oscillator SO16 narrow

ULQ2003

Abstract: 2004a darlington dip 16 SO16 package AEC-Q100 ULQ2001 ULQ2001A ULQ2003A ULQ2004
Contextual Info: ULQ2001 ULQ2003 - ULQ2004 Seven Darlington array Features • Seven Darlington per package ■ Extended temperature range: -40 to 105 °C ■ Output current 500 mA per driver 600 mA peak ■ Output voltage 50 V ■ Automotive Grade product in SO16 package

Contextual Info: RMKMS CNM www.vishay.com Vishay Sfernice SMD Molded, 50 Mil Pitch, Dual-In-Line Thin Film Resistor Networks FEATURES • Tight TCR tracking down to 5 ppm/°C • Monolithic reliability • Low noise < - 35 dB • SMD precision networks Actual Size • SO08, SO14, SO16 cases

Contextual Info: RMKMS CNM www.vishay.com Vishay Sfernice SMD Molded, 50 Mil Pitch, Dual-In-Line Thin Film Resistor Networks FEATURES • Tight TCR tracking down to 5 ppm/°C • Monolithic reliability • Low noise < -35 dB • SMD precision networks Actual Size • SO08, SO14, SO16 cases

SO-08

Abstract: MARKING S408 S408 SO08 SO-14 Marking h 498 RMKMS408
Contextual Info: RMKMS CNM www.vishay.com Vishay Sfernice SMD Molded, 50 Mil Pitch, Dual-In-Line Resistor Networks FEATURES • Tight TCR tracking down to 5 ppm/°C • Monolithic reliability • Low noise < - 35 dB • SMD precision networks • SO08, SO14, SO16 cases Actual Size

S408

Abstract: so08
Contextual Info: RMKMS CNM www.vishay.com Vishay Sfernice SMD Molded, 50 Mil Pitch, Dual-In-Line Resistor Networks FEATURES • Tight TCR tracking down to 5 ppm/°C • Monolithic reliability • Low noise < - 35 dB • SMD precision networks • SO08, SO14, SO16 cases Actual Size

SO18 Package

Abstract: SO16 SO16 package SO16 footprint SO18 footprint SO18 SO20 SO24 F 6553
Contextual Info: Package information - SO16−28 Surface mounted package Package outline ⍜ D E H L c A2 A e A1 b Common dimensions DIM Millimeters Inches DIM Millimeters Min. Max. Inches Min. Max. Min. Max. A 2.35 2.65 0.093 0.104 e A1 0.10 0.30 0.004 0.012 b 0.33 0.51 0.013

Contextual Info: Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Contextual Info: Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; low stand-off height D E SOT109-2 A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

sot162-1

Abstract: MS-013 075E03
Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp L 8 1 e detail X w M bp 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

sot162-1

Abstract: sot162 MS-013-AA
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A A 3 A1 pin 1 index θ Lp L 1 8 e detail X w M bp 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

MS-013 Package

Abstract: MS-013
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp L 8 1 e detail X w M bp 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

970522

Abstract: SOT109-1
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

076E07

Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Contextual Info: Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; body thickness 1.47 mm D E SOT109-3 A X c y HE v M A Z 16 9 A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

MS-012AC

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; body thickness 1.47 mm D E SOT109-3 A X c y HE v M A Z 16 9 A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

sot109

Abstract: SOT109-2
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; low stand-off height D E SOT109-2 A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; low stand-off height D E SOT109-2 A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; low stand-off height D E SOT109-2 A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

74HC4040

Abstract: 74HCT4040 74HC4040BQ 74HC4040D 74HC4040DB 74HC4040N 74HC4040PW HEF4040B JESD22-A114-C
Contextual Info: 74HC4040; 74HCT4040 12-stage binary ripple counter Product data sheet 1. General description The 74HC4040; 74HCT4040 are high-speed Si-gate CMOS devices and are pin compatible with the HEF4040B series. They are specified in compliance with JEDEC standard no. 7A.

74AHC157

Abstract: 74AHC157D 74AHC157PW 74AHCT157 74AHCT157D JESD22-A114E MNA484
Contextual Info: 74AHC157; 74AHCT157 Quad 2-input multiplexer Product data sheet 1. General description The 74AHC/AHCT157 are high-speed Si-gate CMOS devices and are pin compatible with Low Power Schottky TTL LSTTL . They are specified in compliance with JEDEC standard no. 7A.