SN-PB-AG SOLDER PASTE Search Results

Contextual Info: RFCS - Solder Reflow Assembly Instructions www.vishay.com Vishay Electro-Films RFCS - Solder Reflow Assembly Instructions RECOMMENDED SOLDERING PROFILE Sn 96.5 Ag 3 Cu 0.5 lead (Pb -free solder) 250 Not to scale. For reference only 3 200 Temperature (°C)

IXAN0059

Abstract: 95Sn semiconductor power devices diode 47c
Contextual Info: IXAN0059 Lead Free Solder Reflow for Semiconductor Power Devices The solders used in the Electronic Industry are rapidly converting from Tin/Lead Sn/Pb solders to Lead-Free (Pb-Free) solders to meet new environmental and Green requirements. Many of these requirements are controlled by laws and

SZZA024

Abstract: ic ZN 415 ic ZN 415 datasheet CU-106A IPC-A-610C 91Sn Cu6Sn5
Contextual Info: Application Report SZZA024 - January 2001 Evaluation of Nickel/Palladium-Finished ICs With Lead-Free Solder Alloys Douglas Romm, Bernhard Lange, and Donald Abbott Standard Linear & Logic ABSTRACT A nickel/palladium Ni/Pd lead finish for integrated circuits (IC) was introduced in 1989. In

250 micro solder ball

Abstract: garrou fujitsu reflow profile SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY heller 1700 39ag
Contextual Info: Lead-Free Wafer Level-Chip Scale Package: Assembly and Reliability V. Patwardhan, N. Kelkar, and L. Nguyen National Semiconductor Corporation P.O. Box 58090 M/S 19-100 Santa Clara, California 95052 Abstract This paper discusses the reliability testing results of a

Kester sn62 tinning

Abstract: 6-SN62-575 6-SN62 conveyor sn62
Contextual Info: Reflow Soldering of Lead-less LTCC Products AN-40-004 AN-40-004 Rev.: OR M87588 06/30/03 File: AN40004.doc This document and its contents are the property of Mini-Circuits. Page 1 of 4 Table of Contents 1.0 2.0 3.0 Introduction Solders suitable for lead-less LTCC

JIS-C-6429

Abstract: MF-R110-2 USMD1210 MF-R110-2-99 MF-MSMD equivalent alternative ENIG PTC 965
Contextual Info: Bourns Lead Free ® Multifuse Polymer PTCs Circuit Protection Solutions 1 Table Of Contents Table Of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

Contextual Info: 1 20 August, 2013 Agenda  Motivation: Environmental and health endangerment of lead.  Situation: Lead & the use in Electronics  Status on legislation  DA5 Structure and Project:    2 Cooperations and partners Requirements, Applications and Approaches for possible solutions

SN100C

Abstract: Water soluble
Contextual Info: WS482 Water Soluble Cored Wire Solder Features: - Halide-Free - High Activity Level - Good Thermal Transfer - Good Wetting Properties - For Standard and High-Temperature Applications - Extended Cleaning Times, Safe Up to 2 to 3 Days Description: WS482 is a water soluble, halide-free flux cored wire that is highly active and compatible with water soluble solder paste

Heraeus paste profile

Abstract: PD922 reflow profile FOR LGA COMPONENTS J-STD-033 J-STD-033A hot air bga IPC-9701 heraeus
Contextual Info: Application Note June 21, 2008 Document No. : AN007-0001, Ver. 1.21 PDF Name: TLynx_Mfgr_Guide.pdf Application Guidelines for Non-Isolated Converters AN07-001: Manufacturing Guidelines for TLynx Series Modules Introduction The TLynxTM series modules are SMT DC/DC nonisolated converters, that feature a pinless interconnect

amd (BGA) replacement alloy

Abstract: Sn-58Bi NOKIA CIRCUIT PCB SIEMENS WASHING machine TOSHIBA GLASS MOLD washing machine bosch circuit diagram visteon sony antimony
Contextual Info: Lead Pb -Free Packaging Strategy 2000− −2003 . . JUNE 2000 . . . . . . . JAMES HAYWARD . NOTE ON USAGE It is a peculiarity of the English language that “lead” (as in package lead) and “lead” (as in the metallic element) are homographic; that is, they are spelled the same but have different

SAT-5100

Abstract: c5191
Contextual Info: Jan, 2003 Fujitsu Components Limited Relay R&D department FUJITSU COMPONENTS LIMITED Jan, 2003 Schedule Replace current relay solder with lead-free solder by June 2003. Fujitsu’s Third Action Program reference Objective : Fujitsu Objective : Fujitsu Group

zxczm800

Abstract: SDPB1K10NB-7 zds1002 1N4007 MINI MELF ZXCZA200 SBR40S45CT ZXCZM800QPATR ZLNB153X8TC zxnb4200 zetex BSS138TA
Contextual Info: Corporate Address: 15660 N. Dallas Parkway, Suite 850, Dallas, TX 75248 USA Re: End of Vehicle Life Directive EVL 2000/53/EC and Annex II (EVL II) 2000/53/EC Restrictions of Hazardous Substances Directive (ROHS) 2002/95/EC Waste Electrical and Electronic Equipment (WEEE)

AMD reflow soldering profile BGA

Abstract: visteon ford visteon eutectic 157 SMALL ELECTRONICS PROJECTS AMD reflow BGA ROHS nortel meridian Delco SIEMENS WASHING machine TOSHIBA GLASS MOLD
Contextual Info: Lead Pb -Free Packaging Strategy 2000− −2003 . . . . . JUNE 2000 (DECEMBER 2001 Update) . . . . JAMES HAYWARD . NOTE ON USAGE It is a peculiarity of the English language that the words “lead” (as in package lead) and “lead” (as in the metallic element) are homographic; that is, they are spelled the same, although they have

MICRON 63

Abstract: SOLDERING REFLOW smt
Contextual Info: TN-00-15: Recommended Soldering Parameters Introduction Technical Note Recommended Soldering Parameters Introduction This technical note defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. Using these techniques and parameters will prevent

Senju oz

Abstract: senju solder alloys Howard H. Manko Senju
Contextual Info: Walsin Technology Corporation Lead Free MLCC, Chip-R, MLCI SMA Application Guideline HTTP://WWW.PASSIVECOMPONENT.COM Page-1 Walsin Technology Corporation Background Pb free solder material was started in 1995. A composition of Sn-4Bi-2Ag-0.5Cu-0.1Ge was announced in July

SnBiAg

Abstract: senju solder paste WALSIN philips mlcc Senju flux Senju oz
Contextual Info: Walsin Technology Corporation Lead Free MLCC, Chip-R, MLCI SMA Application Guideline HTTP://WWW.PASSIVECOMPONENT.COM Version 03 Page-1 Walsin Technology Corporation Background Sn/Pb Phase Diagram Engineering version Pb free solder material was started in 1995. A

JEDEC J-STD-020d.1

Abstract: sac305 SAC305 reflow profile SAC305 solder paste sac305 kester SAC305 reflow Kester sn-pb-ag solder preform J-STD-020D SAC-305
Contextual Info: APPLICATION NOTE Solder Mounted Packaged Transistors Introduction This document is a supplement to Cree’s data sheet. It describes the recommended conditions under which Cree’s packaged transistors are to be soldered into amplifiers. Solder Temperatures Defined

X-RAY INSPECTION

Abstract: LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance
Contextual Info: Freescale Semiconductor, Inc. Application Note AN2265/D Rev. 0, 03/2002 LGA Application Notes Freescale Semiconductor, Inc. by Thomas Koschmieder and Michael Leoni Introduction The Land Grid Array LGA is an area array matrix package that uses solder paste as

ST-03-Z-06E

Abstract: SHARP IC sharp lead free identification Z06E LH28F800BJE-PTTLZ1 QFN leadframe ST03Z
Contextual Info: Product Change Notification Type of Notification: Standalone IC products will incorporate Lead Pb -Free terminals ISSUE DATE LAST BUY DATE NOTIFICATION NO. LAST SHIP DATE January 23, 2004 — ST-03-Z-06E — This is to advise you that the following product(s) are being changed.

mg 5473

Contextual Info: Package Details SOT-223C Case Mechanical Drawing Lead Code: Part Marking: Full Part Number Reference individual device datasheet. Mounting Pad Geometry Dimensions in mm R2 (4-March 2010) w w w. c e n t r a l s e m i . c o m Package Details SOT-223C Case

bt 1690

Abstract: FBG900
Contextual Info: 100% Material Declaration Data Sheet for 7 Series FBG900 PK546 v1.1 November 2, 2012 Average Weight: 3.7865g Component Substance Description CAS Number or Description Percentage of Component Use in Product Silicon Die Silicon (Si) 7440-21-3 100.00 Basis

FBG676

Contextual Info: 100% Material Declaration Data Sheet for 7 Series FBG676 PK552 v1.1 November 16, 2012 Average Weight: 2.9376g Component Substance Description CAS Number or Description Percentage of Component Use in Product Silicon Die Silicon (Si) 7440-21-3 100.00 Basis

FFG1761

Abstract: AI203 PB SN SOLDER Solder Paste, Indium, Type 3
Contextual Info: 100% Material Declaration Data Sheet for 7 Series FFG1761 PK554 v1.1 October 26, 2012 Average Weight: 20.7610 g Component Substance Description CAS Number or Description Percentage of Component Use in Product Silicon Die Silicon (Si) 7440-21-3 100.00 Basis

FFG900

Abstract: bt 1690 Indium tin oxide
Contextual Info: 100% Material Declaration Data Sheet for 7 Series FFG900 PK524 v1.2 October 12, 2012 Average Weight: 11.5795g Component Substance Description CAS Number or Description Percentage of Component Use in Product Silicon Die Silicon (Si) 7440-21-3 100.00 Basis