SN 8400 N Search Results

Schottky Diode 20V 5A

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package DPAK Package Weight mg 300 Product Group Type No. MBRD320/S – MBRD3100/S MBRD520/S – MBRD5100/S MBRD620CT – MBRD6100CT MBRD820/S – MBRD8100/S MBRD1020/S – MBRD10100/S

OC-106 94V0 C

Abstract: olin 7025 CDA 194 Tamac4 eftec 7025 alloy lead frame sn 8400 Au Sn eutectic thermal conductivity Eftec 64t
Contextual Info: 2 5 Physical Constants of IC Package Materials 1/16/97 3:41 PM CH05WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 5 PHYSICAL CONSTANTS OF IC PACKAGE MATERIALS The Table 5-1 through Table 5-5 list typical values for selected properties of materials used in

olin 7025

Abstract: 7025 alloy lead frame CDA 194 X10-4 eftec-64t Eftec 64t resistivity table sn 8400 PHYSICAL CONSTANTS OF IC PACKAGE MATERIALS
Contextual Info: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-3 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Units

olin 7025

Abstract: eftec MPA 68 Eftec 64t sn 8400 7025 alloy lead frame resistivity table eftec-64t tamac X10-4
Contextual Info: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-3 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Alumina

olin 7025

Abstract: Tamac4 TAMAC-4 7025 alloy lead frame CDA 194 sn 8400 eftec eftec-64t C10B4 tamac
Contextual Info: CHAPTER 5 SELECTED PROPERTIES OF IC PACKAGE MATERIALS The following tables list typical values for selected properties of materials used in IC packages Table 5-1 Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Units

ISO 8820-3

Abstract: DIN 72581 040204 SAE 1888
Contextual Info: BLADE-TYPE FUSES WICKMANN FK3 / No. 169.6885 ISO 8820, 32V 32V, T Specifications Time-Current Characteristic Packaging Code and Info Time Lag T 2: Bulk (1000 pcs.) Standards Materials DIN 72581/3E SAE J 1888 ISO 8820-3 UL 248 Body: Element: Cover: Terminals:

tag 8820

Contextual Info: FLACHSICHERUNGSEINSÄTZE FK3 / Nr. 169 TOE / Nr. 165 WICKMANN ISO 8820, 32V/58V 32V/58V, T Spezifikationen Zeit-Strom Charakteristik Verpackung Träge T 100: Karton (600 St.) Normen Materialien DIN 72581/3E SAE J 1888 ISO 8820 Gehäuse: Farbcodiertes Thermoplast,

sn 8400

Abstract: Pudenz ISO 8820
Contextual Info: BLADE-TYPE FUSES WICKMANN FK3 / No. 169.6885 formerly 169 ISO 8820, 32V 32V, T Specifications Time-Current Characteristic Packaging Time Lag T 2: Bulk (1000 pcs.) Standards Materials DIN 72581/3E SAE J 1888 ISO 8820 Body: Element: Cover: Terminals: Features

SAE 1888

Abstract: 95 marking
Contextual Info: BLADE-TYPE FUSES WICKMANN FK3 / No. 169 TOE / No. 165 ISO 8820, 32V/58V 32V/58V, T Specifications Time-Current Characteristic Packaging Time Lag T 100: Bulk (1000 pcs.) Standards Materials DIN 72581/3E SAE J 1888 ISO 8820 UL 248 Body: Element: Cover: Terminals:

Contextual Info: BLADE-TYPE FUSES WICKMANN FK3 / No. 169 TOE / No. 165 ISO 8820, 32V/58V 32V/58V, T Specifications Time-Current Characteristic Packaging Time Lag T 100: Bulk (600 pcs.) Standards Materials DIN 72581/3E SAE J 1888 ISO 8820 Body: Element: Cover: Terminals:

Material density CDA 195

Abstract: eutectic 157 CDA 194 olin 7025 Eftec 64t X10-4 resistivity table sn 8400 MF202 silver
Contextual Info: Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-9 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Properties Density Modulus of Elasticity Tensile Strength Alumina

ESQT

Abstract: ESQT 110 skt 230 ESQT-130-03 1-800-SAMTEC-9 F-202 PC104
Contextual Info: Approved Manufacturers 415-0049-WEB List for Web Parts REVISION HISTORY Description of Change Rev ECO# A E11933 Internal Release Date Apvd By B E11949 Internal Revision- no change to part. 05/22/02 KlS C E12218 Release part to Web Store. 02/11/03 KlS KlS 05/06/02

SMD marking 1N3

Abstract: marking 1N3 smd marked rc HFQ02-5N9 sn 8400
Contextual Info: RoHS High Frequency, High Q Chip Inductor Dimensions: HFCQ02 Inches mm 0.012±0.001 (0.30±0.03) 0.006±0.002 (0.15±0.05) 0.024±0.001 (0.60±0.03) 0.012±0.001 (0.30±0.03) Allied Part Number HFQ02-0N6_-RC HFQ02-0N7_-RC HFQ02-0N8_-RC HFQ02-0N9_-RC HFQ02-1N0_-RC

Contextual Info: RoHS High Frequency, High Q Chip Inductor Dimensions: HFCQ02 Inches mm 0.012±0.001 (0.30±0.03) 0.006±0.002 (0.15±0.05) 0.024±0.001 (0.60±0.03) 0.012±0.001 (0.30±0.03) Allied Part Number HFQ02-0N6_-RC HFQ02-0N7_-RC HFQ02-0N8_-RC HFQ02-0N9_-RC HFQ02-1N0_-RC

skt 230

Abstract: 1-800-SAMTEC-9 F-202
Contextual Info: Approved Manufacturers 416-0004-WEB List for Web Parts REVISION HISTORY Description of Change Rev ECO# A E12066 Internal Release 09/18/02 Date Apvd By KlS B E12218 Release part to Web Store 02/11/03 KlS Approved Manufacturers: NOTE: In some cases, components under the same part number may originate from various manufacturers,

TO-238

Abstract: sn 8400
Contextual Info: I X Y S 1ÔE CORP OOOOtaSS D 5 'T - Z ° \ A S> □IXYS A D V A N C E TEC H N IC AL DATA SH EET* December 1988 DATA SH EET NO. 1300C HiPerFET Power MOSFETs IXFN100N10 N-Channel High dv/dt, Lowtrr, H D M O S™ Family FEATURES:_

hmc830

Abstract: HMC1060LP3 HMC833
Contextual Info: HMC834LP6GE v00.1211 FRACTIONAL-N PLL WITH INTEGRATED VCO 45 - 1050, 1400 - 2100, 2800 - 4200, 5600 - 8400 MHz Features • RF Bandwidth: 45 - 1050, 1400 - 2100, 2800 - 4200, 5600 - 8400 MHz • Maximum Phase Detector Rate 100 MHz • Ultra Low Phase Noise

HMC833

Abstract: usb SD3
Contextual Info: HMC834LP6GE v01.0112 Fractional-N PLL with Integrated VCO 45 - 1050, 1400 - 2100, 2800 - 4200, 5600 - 8400 MHz PLLs with Integrated VCO - SMT Features 1 • RF Bandwidth: 45 - 1050, 1400 - 2100, 2800 - 4200, 5600 - 8400 MHz • Maximum Phase Detector Rate

EVAL01-HMC834LP6GE

Abstract: HMC833 HMC834LP6GE HMC830 007FFFH Synthesizers with 3.0 GHz Integer PLL for USB H834 Reg05
Contextual Info: HMC834LP6GE v00.1211 FRACTIONAL-N PLL WITH INTEGRATED VCO 45 - 1050, 1400 - 2100, 2800 - 4200, 5600 - 8400 MHz Features • RF Bandwidth: 45 - 1050, 1400 - 2100, 2800 - 4200, 5600 - 8400 MHz • Maximum Phase Detector Rate 100 MHz • Ultra Low Phase Noise

IXFN64N20

Abstract: 1301C
Contextual Info: I X Y S CÔRP 1ÖE D 4bôb5Hb QOQObS? =1 - 3 □IXYS DATA SH EET NO. 1301C A D V A N C E T E C H N IC A L DATA S H E E T * HiPerFET Power MOSFETs ^ 5 December 1988 IXFN64N20 N-Channel High dv/dt, Low trr, H D M O S ™ Family 64A FEATU RES:_

SUMIKA

Abstract: PDB1003 PDB1003100MZF PDB1003101MZF PDB1003150MZF PDB1003151MZF PDB1003220MZF PDB1003221MZF PDB1003330MZF PDB1003331MZF
Contextual Info: SMD POWER INDUCTORS PDB1003 SERIES 1. PART NO. EXPRESSION : PDB1003101MZF a (b) (c) (d)(e)(f) (a) Series code (d) Tolerance code : M = ±20% (b) Dimension code (e) X, Y, Z : Standard part (c) Inductance code : 101 = 100uH (f) F : Lead Free 2. CONFIGURATION & DIMENSIONS :

RBS 6401

Abstract: scn8048
Contextual Info: Signefics SCN8400 Series Single-Chip 8-Bit Microcontroller Product Specification Microprocessor Products PIN CONFIGURATION DESCRIPTION FEATURES The SCN84XX family of microcontrollers is fabricated in NMOS. The family con­ sists of five devices. Each version has

MAB8400

Contextual Info: Philips Com ponents-Signetics Application Note D ocum ent Cari Fenger A u th o rs D ecem ber 1988 Date RF C o m m u n ic a tio n s INTRODUCTION The i2C Inter-IC bus is becom ing a popular concept which im plem ents an innovative serial bus protocol that needs

SCN8048

Abstract: 0.2MF CAPACITOR MAB8021 Philips MAB8021 8048 microcontroller tc017 2732 rom 4K block diagram of 8048 microcontroller
Contextual Info: Signetics SCN8400 Series Single-Chip 8-Bit Microcontroller Product Specification Microprocessor Products PIN CONFIGURATION DESCRIPTION FEATURES T h e S C N 8 4 X X family of microcontrollers is fabricated in N M O S . T h e family con­ sists of five devices. Each version has