SMT REFLOW PROFILE Search Results

all ic data

Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
Contextual Info: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile

smt machines

Abstract: IPC-A610B pin header stand-off pin in paste pin header standoff pin in paste
Contextual Info: SL-SMT Through-Hole-Reflow SL-SMT … reduces costs in the production process SL-SMT are the high temperature resistant pin headers specially developed to be compatible with reflow production processes. Existing pcb connector headers cannot withstand the high temperatures

652 smd

Abstract: smd 1226 971-SLK-CPL THr 854 smd 227 971-SLR-SMD-1.1/08-TR
Contextual Info: 343-2012:QuarkCatalogTempNew 8/28/12 5:52 PM Page 343 Genuine Surface Mount SMT and Through-Hole Reflow (THR) Terminal Blocks SMT — Through-Hole Reflow Headers RoHS Performs total dynamic adaptability toplander versions of PCB. RoHS Horizontal header with standoffs underneath the molding to prevent bottom

all ic data

Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
Contextual Info: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile

Intel reflow soldering profile BGA

Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Contextual Info: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.

Systems

Abstract: systemtechnik 60352-5 component data SAC305 laser soldering through hole technology SAC305 DIN EN 60352-5 din mount pcb connector mini din 9 male
Contextual Info: Electronic Board Assembly ERNI Systems Technology Systems Solutions - a one stop shop - www.erni.com Contents ERNI Systems Technology Soldering Technologies SMT soldering - Reflow Soldering of Surface Mount Devices THR soldering - Through Hole Components, reflow soldered

CERPAK

Abstract: XL250 XL150 XL202
Contextual Info: a TECHNICAL NOTE ONE TECHNOLOGY WAY • P.O. BOX 9106 • NORWOOD, MASSACHUSETTS 02062-9106 • 781/329-4700 Reflow Soldering Profile for 14 pin SMT Cerpak Package XL202, XL210, XL150, XL250 by Jim Doscher Reflow Soldering Temperature Profile Temp (deg C)

Contextual Info: www.eLED.com EM2520SECK09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SECK09 Recommended Soldering Pattern Units : mm

Contextual Info: Multi-position printed circuit termination blocks for through hole reflow applications With the modern SMT solder technology, proven housing profiles from the printed circuit terminal block range from Phoenix Contact are today also used in the reflow process without any further geometric adaptions.

Contextual Info: Multi-position printed circuit termination blocks for through hole reflow applications With the modern SMT solder technology, proven housing profiles from the printed circuit terminal block range from Phoenix Contact are today also used in the reflow process without any further geometric adaptions.

Contextual Info: www.eLED.com EM2520SYCK09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SYCK09 Recommended Soldering Pattern Units : mm

Contextual Info: www.eLED.com EM2520SYC09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SYC09 Recommended Soldering Pattern Units : mm

Contextual Info: www.eLED.com EM2520SEC09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SEC09 Recommended Soldering Pattern Units : mm

Contextual Info: CD-TCE054-0302 Power inductors SMT type CD-C-0707 series Features • Low profile • High current type • Reflow soldering • SMT compatibility Applications • DC-DC converters • Power supplies Typical DC overlapping characteristics Withstand voltage

MM4329-2700TB1

Abstract: MM4329 MM4329-2700 MM121390 MM121400 MM4329-2700TB2
Contextual Info: COAXIAL CONNECTORS SMT, MICRO MINIATURE CCR Series FEATURES • ■ ■ ■ ■ Micro miniature, low profile 4.2mm max. For SMT and reflow soldering Tape and reel available High performance (V.S.W.R. 1.2 max. at 2GHz) Available with ultra-thin coaxial cables

Contextual Info: SMT Trimmer Potentiometers/EVM3W 3 mm Square Low-Profile SMT Trimmer Potentiometers Cermet, Open Frame Type Type: EVM3W n Features l l l l l n Recommended Applications Low-profile (0.95 mm ~ 1.1 mm max.) Cross slot type for reflow soldering Excellent mountability

Contextual Info: SMT Trimmer Potentiometers/EVM3Y/3S 3 mm Square SMT Trimmer Potentiometers Cermet, Open Frame Type Type: EVM3Y EVM3S n Features l Low-profile for automatic adjustment type with knob (EVM3Y) l Both sides adjust type (EVM3S) for reflow soldering l Excellent mounting efficiency

sn63pb37 solder SPHERES

Abstract: J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D
Contextual Info: SMT Board Assembly Process Recommendations AN-353-4.0 Application Note This application note describes the board assembly process used in surface-mount technology SMT and focuses on the SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing individual

Contextual Info: SMT Trimmer Potentiometers/EVM2W 2 mm Square Low-Profile SMT Trimmer Potentiometers Cermet, Open Frame Type Type: EVM2W n Features l The lowest profile in this category 1.05mm (1.2 mm max.) l Cross slot type for reflow soldering l Automatic adjustment type

b178

Abstract: B-178 B330
Contextual Info: SMT Trimmer Potentiometers/EVM3Y/3S 3 mm Square SMT Trimmer Potentiometers Cermet, Open Frame Type Type: EVM3Y EVM3S n Features l Low-profile for automatic adjustment type with knob (EVM3Y) l Both sides adjust type (EVM3S) for reflow soldering l Excellent mounting efficiency

Contextual Info: SMT Trimmer Potentiometers/EVM3Y/3S 3 mm Square SMT Trimmer Potentiometers Cermet, Open Frame Type Type: EVM3Y EVM3S n Features n Recommended Applications l Low-profile for automatic adjustment (EVM3Y) l Both sides adjust (EVM3S) for reflow soldering l Excellent mounting efficiency

Contextual Info: SMT Trimmer Potentiometers/EVM3Y/3S 3 mm Square SMT Trimmer Potentiometers Cermet, Open Frame Type Type: EVM3Y EVM3S n Features l Low-profile for automatic adjustment type with knob (EVM3Y) l Both sides adjust type (EVM3S) for reflow soldering l Excellent mounting efficiency

Contextual Info: SMT Trimmer Potentiometers/EVM3W 3 mm Square Low-Profile SMT Trimmer Potentiometers Cermet, Open Frame Type Type: EVM3W n Features l l l l l n Recommended Applications Low-profile (0.95 mm ~ 1.1 mm max.) Cross slot type for reflow soldering Excellent mountability

Contextual Info: SMT Trimmer Potentiometers/EVM2W 2 mm Square Low-Profile SMT Trimmer Potentiometers Cermet, Open Frame Type Type: EVM2W n Features n Recommended Applications l Low-profile 1.05 mm (1.2 mm max.) l Cross slot type for reflow soldering l Automatic adjustment type