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    SII-DB-1075-A02 Search Results

    SII-DB-1075-A02 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    55101-T1103A02LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in)Pitch, A02 Pin Polarized. PDF
    10135562-107500ULF
    Amphenol Communications Solutions ExaMEZZ® 56Gb/s High Speed Mezzanine 2-pair, 13 column, 7.5mm stacking height, 104contacts PDF
    10135570-107500ULF
    Amphenol Communications Solutions ExaMEZZ® 56Gb/s High Speed Mezzanine 4-pair, 7 column, 7.5mm stacking height, 98contacts PDF
    861400182YO10754LF
    Amphenol Communications Solutions Board to Board connector, Unshrouded Header, Through Hole, Double Row, 18 Position, Vertical. PDF
    10127225-107501ULF
    Amphenol Communications Solutions ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, Hermaphroditic, Vertical, Press-Fit, 2 Pair, 19 Column, 152 Position, 7.50mm Stack Height, 2.00mm (0.079in) Column Pitch PDF