SIGC68T170R3E Search Results
SIGC68T170R3E Price and Stock
Infineon Technologies AG
Infineon Technologies AG SIGC68T170R3EX1SA1IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC68T170R3EX1SA1) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SIGC68T170R3EX1SA1 | Waffle Pack | 20 Weeks | 3,528 |
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Buy Now | |||||
SIGC68T170R3E Datasheets Context Search
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Contextual Info: SIGC68T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology low turn-off losses short tail current positive temperature coefficient easy paralleling This chip is used for: power modules C Applications: drives G |
Original |
SIGC68T170R3E L7761M, L7761T, L7761E, | |
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Contextual Info: SIGC68T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling This chip is used for: • power modules C Applications: • drives G |
Original |
SIGC68T170R3E L7761T, |