SIGC42T170R3GE Search Results
SIGC42T170R3GE Price and Stock
Infineon Technologies AG
Infineon Technologies AG SIGC42T170R3GEX1SA2IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC42T170R3GEX1SA2) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SIGC42T170R3GEX1SA2 | Waffle Pack | 5,760 |
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SIGC42T170R3GE Datasheets Context Search
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Contextual Info: SIGC42T170R3GE IGBT3 Power Chip Features: • 1700V Trench + Field Stop technology low turn-off losses short tail current positive temperature coefficient easy paralleling Chip Type VCE SIGC42T170R3GE 1700V This chip is used for: power module |
Original |
SIGC42T170R3GE SIGC42T170R3GE L7751M, L7751T, L7751E, | |
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Contextual Info: SIGC42T170R3GE IGBT3 Chip Features: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type VCE SIGC42T170R3GE 1700V This chip is used for: • power module |
Original |
SIGC42T170R3GE SIGC42T170R3GE L7751T, |