SIGC158T170R3E Search Results
SIGC158T170R3E Price and Stock
Infineon Technologies AG
Infineon Technologies AG SIGC158T170R3EX1SA3IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC158T170R3EX1SA3) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SIGC158T170R3EX1SA3 | Waffle Pack | 20 Weeks | 1,431 |
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SIGC158T170R3E Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: SIGC158T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology low turn-off losses short tail current positive temperature coefficient easy paralleling Chip Type SIGC158T170R3E VCE IC 1700V 125A This chip is used for: power modules |
Original |
SIGC158T170R3E L7801M, L7801T, L7801E, | |
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Contextual Info: SIGC158T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC158T170R3E VCE IC 1700V 125A This chip is used for: • power modules |
Original |
SIGC158T170R3E L7801T, |