SIEMENS PACKAGE OUTLINE Search Results

Siemens Aktiengesellschaft

Contextual Info: Package Outlines Siemens Aktiengesellschaft 245 Summary of Package Outlines Memory Components Siemens Aktiengesellschaft 246 Summary of Package Outlines Siemens Aktiengesellschaft 247 Summary of Package Outlines Memory Modules Siemens Aktiengesellschaft 248

TO-220AB Option E3045 Package

Abstract: TO-220AB Option E3044 Package
Contextual Info: Gehäusemaßbilder Package Outlines SIEMENS Gehäusemaßbilder Package Outlines Maße in mm, wenn nicht anders angegeben (Dimensions in mm, unless otherwise specified) Bild 9 Semiconductor Group Figure 9 135 GehäusemaBbllder Package Outlines SIEMENS - 15 -14.8-

Circuit Diagrams

Abstract: siemens Package Outlines ECONOPACK
Contextual Info: SIEMENS Package Outlines and Circuit Diagrams Fig. 1 W eight: 150 g Dim ensions in mm Fig. 2 W eight: 250 g Dim ensions in mm SIS00026 Sem iconductor Group 302 SIEMENS Package Outlines and Circfuit Diagrams Fig. 3 W eight: 190 g Dim ensions in mm Fig. 4 W eight: 420 g

1607b

Abstract: C1039 C513 SAB-C513A-L16P "C513A-L16P" CPU 103 siemens Marking AD6 siemens crystal clock
Contextual Info: SIEMENS This Material Copyrighted By Its Respective Manufacturer SAB-C513A-L16P 16 MHz Specification SIEMENS Ordering Information Type Ordering Code Package Description 8-Bit CMOS Microcontroller SAB-C513A-L16P Q 67120-C1039 P-DIP-40 for external memory, 16 MHz

BUP101

Abstract: bup transistor A 671 transistor
Contextual Info: • 823SbD5 QDSlBb^ 2 O S I E G SIEMENS SIEMENS AKTIENGESELLSCHAF 47E I> r-3 3 -13 BUP101 SIRET Siemens Ring Emitter Transistor VGe = 1000 V /0 =15 A • N channel • Breakdown-proof • Package: TO-218 AA TO P-3 1) Type Ordering code B U P 101 C 6 7 060-A 1000-A 2

MARKING SMD T43

Abstract: siemens Package Outlines Plastic Package siemens Package Outlines smd marking l5 7750a
Contextual Info: Package Outlines SIEMENS Mem ory Com ponents P-DIP-20-2 Plastic Package Plastic dual in-line package P-SOJ-26/20-1 (SMD) Plastic Package (Plastic small outline J-lead) P-SOJ-26/20-5 (SMD) Plastic Package (Plastic dual in-line package) P-SO J-28-2 (SMD) Plastic Package

Contextual Info: SIEMENS ^ FEATURES ILD256 DUAL AC INPUT PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLER Package Dimensions in Inches mm • Each Channel: Guaranteed CTR Symmetry, 2:1 Maximum • Bidirectional AC Input • Industry Standard SOIC-0 Surface Mountable Package

siemens Package Outlines

Abstract: l20x
Contextual Info: Summary of Types in Alphanumerical Order Semiconductor Group - Addresses Information on Literature Package Outlines SIEMENS P-SOJ-28-2 SMD Plastic Package (small outline J-lead) P-SOJ-40-1 (SMD) Plastic Package (small outline J-lead) P-SOJ-26/24-1 (300 mil) (SMD)

Contextual Info: bOE ]> B Ö235b05 QQMSTDI 10b M S I E G SIEMENS SIEMENS AKTIEN6ESELLSCHAF • 7 ^ 3 SIMOPAC Module BSM 191 V DS = 1000 V / d =28 A ^ DS on = 0.37 Q • • • • • • Power module Single switch N channel Enhancement mode Package with insulated metal base plate

Contextual Info: bOE J> • fl235b05 00M5tiôE 133 « S I E G SIEMENS SIEMENS AKTIENGESELLSCHAF SIMOPAC Module VDS / D R DS on BSM151 = 500 V =48 A “ 0.12 £2 • Power module • Single switch • N channel • Enhancement mode • Package with insulated metal base plate

Contextual Info: SIEMENS IL256 AC INPUT PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLER FEATURES Package Dimensions in Inches mm • Guranteed CTR Symmetry, 2:1 Maximum • Bidirectional AC Input • Industry Standard SOIC-8 Surface Mountable Package • Standard Lead Spacing, .05*

25C31

Abstract: 5113 LED
Contextual Info: SIEMENS FEATURES IL256 AC INPUT PHOTOTRANSISTOR SMAUL OUTLINE SURFACE MOUNT OPTOCOUPLER Package Dimensions in Inches mm • Guranteed CTR Symmetry, 2:1 Maximum • B idirectional AC Input • Industry Standard SOtC-8 Surface Mountable Package • Standard Lead Spacing, .05*

8 pin SMD relay

Abstract: optocoupler smd 8 Siemens optocoupler
Contextual Info: Telecom Switches SIEMENS FEATURES DESCRIPTION • Solid state relay and an autopolarity optocoupler in a single package • Low-profile, small-outline package SOP available • Up to 5300 Vrms I/O minimum • Surface mountable • Optocoupler — Bidirectional current detection

bsm181

Contextual Info: bOE D • flB35bDS 0 0 4 5 ^ 5 ATI ISIEG SIEMENS -n-39~iS~ SIEMENS AKTIENGESELLSCHAF SIMOPAC Module ^DS BSM 181 BSM 181 R = 100V = 200 A ^ Ds on = 8.5 m il I D • Power module • Single switch • N channel • Enhancement mode • Package with insulated metal base plate

BSM141

Abstract: d45b V103
Contextual Info: bOE ]> • fi23 SbGS Gü 4Sb 7 b ^31 ■ SIEG SIEMENS SIEMENS AKTIEN 6 ESELLSCHAF T-3^/5- SIMOPAC Module V DS / D = 400 V =60 A ^ = 0.075 • • • • • • DS on BSM 141 i 2 Power m odule Single switch N channel Enhancement mode Package with insulated m etal base plate

Contextual Info: bOE D • fl53SbOS 004S71b 34b ■ S I E G SIEMENS SIEMENS AKTIENGESELLSCHAF SIMOPAC Module V DS ID BSM 191 F = 1000 V =28 A R ds on = 0 .4 2 £2 • • • • • • • Power module Single switch FREDFET N channel Enhancement mode Package with insulated metal base plate

Contextual Info: bOE D • fi23SbDS DDMSbbT ?TT H S I E 6 SIEMENS SIEMENS AKTIEN6ESELLSCHAF 'P 3 SIMOPAC Module CÍ - J 5 ' BSM 121 AR V DS = 200 V I D = 130 A ^ DS on = 20 m i) • • • • • • Power module Single switch N channel Enhancement mode Package with insulated metal base plate

Contextual Info: H ISIE G â235bG5 0020077 s SIEMENS SIEMENS A KT IE NGESELLSCHAF 47E T> T -39-/5 SIMOPAC MOSFET Module ^03 A ^DS on) • • • • • • BSM 121 AR (C) = 200 V = 130 A '=» 20 mfl Power module Single switch N channel Enhancement mode Package with insulated metal base plate

KTY 10-6

Abstract: KTY10 KTY temperature sensor 10-62 Q62705-K110 temperature DEPENDENT RESISTOR Q62705-K331 KTY10 Siemens
Contextual Info: SIEMENS Silicon Spreading Resistance Temperature Leaded Plastic Package lorin K T 100 KTY10 Features • Temperature dependent Resistor with Positive Temperature Coefficient • Small plastic package • Fast response • High reliability due to multilayer gold contacts

kty 110 15

Contextual Info: SIEMENS Silicon Spreading Resistance Temperature Sensor in Miniature Leaded Plastic Package K T 110, KT 210, KTY 11, KTY 21 Features • Temperature dependent Resistor with Positive Temperature Coefficient • Miniature plastic package for very small thermal time

R01C

Contextual Info: SIEMENS ILD205T/06T/07T/11T/13T/17T DUAL PHOTOTRANSISTOR SMALL OUTLINE SURFACE MOUNT OPTOCOUPLER FEATURES Package Dim ensions in Inches mm • Two Channel Coupler • Industry Standard SOIC-8 Surface Mountable Package • Standard Lead Spacing of .05" • Available In Tape and Reel (suffix T)

BSM300GA120DN2E3166

Abstract: C67070-A2007-A70 D273 siemens igbt BSM300GA120DN2
Contextual Info: SIEMENS BSM300GA120DN2E3166 IGBT Power Module Preliminary data • Single switch • Including fast free-wheeling diodes • Enlarged diode area • Package with insulated metal base plate Type BSM300GA120DN2E3166 VCE 1200V 430A Package Ordering Code SINGLE SWITCH 1

Contextual Info: SIEMENS BSM150GB120DN2E3166 IGBT Power Module Preliminary data • Half-bridge • Including fast free-wheeling diodes • Enlarged diode area • Package with insulated metal base plate BSM150GB120DN2E3166 h 1200V 210A 111 Type Package Ordering Code HALF-BRIDGE 2

BSM 214 A

Abstract: 78AK
Contextual Info: SIEMENS SIMOPAC Module V DS ¡0 =100V =2x125 A R = 0.013 i l • • • • • • DS on BSM 214 A Power module Half-bridge N channel Enhancem ent mode Package with insulated metal base plate Package outline/Circuit diagram : 2a11 Type O rdering Code