SIDC14D120H8 Search Results
SIDC14D120H8 Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SIDC14D120H8X1SA1 |
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Discrete Semiconductor Products - Diodes - Rectifiers - Single - DIODE GEN PURP 1.2KV 25A WAFER | Original | 167.99KB |
SIDC14D120H8 Price and Stock
Infineon Technologies AG
Infineon Technologies AG SIDC14D120H8X1SA1Diode Switching 25A DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC14D120H8X1SA1) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SIDC14D120H8X1SA1 | Waffle Pack | 20 Weeks | 16,911 |
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SIDC14D120H8X1SA1 | 1,126 |
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SIDC14D120H8 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
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Contextual Info: SIDC14D120H8 Fast switching diode chip in Emitter Controlled Technology Features: • 1200V technology 120 µm chip soft, fast switching low reverse recovery charge small temperature coefficient qualified according to JEDEC for target applications |
Original |
SIDC14D120H8 L4055C, | |
soft solder die bondingContextual Info: SIDC14D120H8 Fast switching diode chip in Emitter Controlled -Technology Features: • 1200V Emitter Controlled technology 120 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient A This chip is used for: • EUPEC power modules and |
Original |
SIDC14D120H8 L4055C, soft solder die bonding |