| 75970-8AU-02LF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,2 Positions, 2.54 mm (0.100in) Pitch. | PDF |  | 
| 75970-8AP-02LF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,2 Positions, 2.54 mm (0.100in) Pitch. | PDF |  | 
| 75970-8AP-04LF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,4 Positions, 2.54 mm (0.100in) Pitch. | PDF |  | 
| 75970-8AM-10LF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,10 Positions, 2.54 mm (0.100in) Pitch. | PDF |  | 
| TMP708AIDBVR |  | Texas Instruments | Resistor-Programmable Trip Point Temperature Switch 5-SOT-23 -40 to 125 |   |   |