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    SG-BGA-7125 Search Results

    SG-BGA-7125 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    71257-0000LF
    Amphenol Communications Solutions Card Bus Header, Top Mount, S/D(68Pins), R/A, Type 123, 3.3V, 0mm s/o PDF
    84512-202LF
    Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    74221-201LF
    Amphenol Communications Solutions 400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    84500-002
    Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84500-102
    Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF

    SG-BGA-7125 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SG-BGA-7125
    Ironwood Electronics High Density GHz BGA Sockets; Max Pincount: 475; Top Pitch (mm): 0.5; IC Array X: 19; IC Array Y: 25; Socket Lid: no; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 1.2; IC Size X (mm): 10; IC Size Y (mm): 13; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.1; IC Ball Height Min (mm): 0.5; IC Ball Height Max (mm): IC Ball Diameter Max (mm): 0.35; Max Package Code: BGA475; Part Description: GHz BGA Socket (ZIF)-Epoxy Original PDF 91.55KB 4