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    SG-BGA-7112 Search Results

    SG-BGA-7112 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    7112S2015X02LF
    		Amphenol Communications Solutions Connectors for Portable Environments, hinge and cover, with pegs Lead Free PDF
    7112S0815X01LF
    		Amphenol Communications Solutions Connectors for Portable Environments, hinge and cover Lead Free PDF
    7112S0825X01LF
    		Amphenol Communications Solutions Connectors for Portable Environments, hinge and cover Lead Free PDF
    7112S0815X11LF
    		Amphenol Communications Solutions Connectors for Portable Environments, hinge and cover Lead Free PDF
    7112S0815X29LF
    		Amphenol Communications Solutions SIM Card Connector, Storage and Server Connectors, Connectors for Portable Environments, hinge and cover Lead Free PDF

    SG-BGA-7112 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SG-BGA-7112
    		Ironwood Electronics High Density GHz BGA Sockets; Max Pincount: 375; Top Pitch (mm): 0.5; IC Array X: 15; IC Array Y: 25; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 1; IC Size X (mm): 8; IC Size Y (mm): 13; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.1; IC Ball Height Max (mm): 0.25; IC Ball Diameter Max (mm): 0.35; Max Package Code: BGA375; Part Description: GHz BGA Socket (ZIF)-HD Original PDF 119.62KB 5