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SG-BGA-7093
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Ironwood Electronics
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High Density GHz BGA Sockets; Max Pincount: 256; Top Pitch (mm): 0.4; IC Array X: 16; IC Array Y: 16; Socket Lid: no; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: no; IC Total Height Max (mm): 1; IC Size X (mm): 8; IC Size Y (mm): 8; IC Size Tolerance (mm): 0.15; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.125; IC Ball Height Max (mm): IC Ball Diameter Max (mm): 0.3; Max Package Code: BGA256; Part Description: GHz BGA Socket (ZIF)-Epoxy |
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