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    SG-BGA-7089 Search Results

    SG-BGA-7089 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202LF
    		Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    74221-201LF
    		Amphenol Communications Solutions 400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    84500-002
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84500-102
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84517-001
    		Amphenol Communications Solutions 200 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array PDF

    SG-BGA-7089 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SG-BGA-7089
    		Ironwood Electronics High Density GHz BGA Sockets; Max Pincount: 256; Top Pitch (mm): 0.4; IC Array X: 16; IC Array Y: 16; Socket Lid: no; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: no; IC Total Height Max (mm): 1; IC Size X (mm): 7; IC Size Y (mm): 7; IC Size Tolerance (mm): 0.15; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.125; IC Ball Height Max (mm): IC Ball Diameter Max (mm): 0.3; Max Package Code: BGA256; Part Description: GHz BGA Socket (ZIF)-Epoxy Original PDF 78.26KB 4