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SG-BGA-7080
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Ironwood Electronics
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High Density GHz BGA Sockets; Max Pincount: 225; Top Pitch (mm): 0.65; IC Array X: 22; IC Array Y: 22; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 1.4; IC Size X (mm): 15; IC Size Y (mm): 15; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.1; IC Ball Height Min (mm): 0.21; IC Ball Height Max (mm): 0.36; IC Ball Diameter Max (mm): 0.45; Max Package Code: BGA225; Part Description: GHz BGA Socket (ZIF)-HD |
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