Part Number
    Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SG-BGA-7072 Search Results

    SG-BGA-7072 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202LF
    		Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    74221-201LF
    		Amphenol Communications Solutions 400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    84500-002
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84500-102
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84517-001
    		Amphenol Communications Solutions 200 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array PDF

    SG-BGA-7072 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SG-BGA-7072
    		Ironwood Electronics High Density GHz BGA Sockets; Max Pincount: 327; Top Pitch (mm): 0.5; IC Array X: 19; IC Array Y: 23; Socket Lid: no; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 1.32; IC Size X (mm): 10; IC Size Y (mm): 17; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.1; IC Ball Height Min (mm): 0.17; IC Ball Height Max (mm): 0.27; IC Ball Diameter Max (mm): 0.35; Max Package Code: BGA627; Part Description: GHz BGA Socket (ZIF)-HD Original PDF 95.38KB 4