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SG-BGA-7064
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Ironwood Electronics
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High Density GHz BGA Sockets; Max Pincount: 48; Top Pitch (mm): 0.75; IC Array X: 6; IC Array Y: 8; Socket Lid: no; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: no; IC Total Height Max (mm): 1; IC Size X (mm): 7.286; IC Size Y (mm): 10.85; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.25; IC Ball Height Min (mm): 0.1; IC Ball Height Max (mm): 0.425; IC Ball Diameter Max (mm): 0.15; Max Package Code: Part Description: GHz BGA Socket (ZIF)-Epoxy |
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