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SG-BGA-7063
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Ironwood Electronics
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High Density GHz BGA Sockets; Max Pincount: 324; Top Pitch (mm): 0.65; IC Array X: 18; IC Array Y: 18; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 0.98; IC Size X (mm): 13; IC Size Y (mm): 13; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.15; IC Ball Height Min (mm): 0.17; IC Ball Height Max (mm): 0.27; IC Ball Diameter Max (mm): 0.4; Max Package Code: Part Description: GHz BGA Socket (ZIF)-HD |
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