|
SG-BGA-7062
|
|
Ironwood Electronics
|
High Density GHz BGA Sockets; Max Pincount: 361; Top Pitch (mm): 0.65; IC Array X: 19; IC Array Y: 19; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 1.4; IC Size X (mm): 13; IC Size Y (mm): 13; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.1; IC Ball Height Min (mm): 0.25; IC Ball Height Max (mm): 0.3; IC Ball Diameter Max (mm): 0.45; Max Package Code: Part Description: GHz BGA Socket (ZIF)-HD |
Original |
PDF
|
75.42KB |
4 |