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    SG-BGA-7026 Search Results

    SG-BGA-7026 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    70264-101LF
    		Amphenol Communications Solutions Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, Straight, Solder-to-Board, Narrow Body. PDF
    70264-105LF
    		Amphenol Communications Solutions 4 Row Signal Header,24 Position Straight, Solder-to-Board, Narrow Body PDF
    70264-210LF
    		Amphenol Communications Solutions Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, Straight, Solder-to-Board, Narrow Body. PDF
    70264-201LF
    		Amphenol Communications Solutions Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, Straight, Solder-to-Board, Narrow Body. PDF
    70264-205LF
    		Amphenol Communications Solutions 4 Row Signal Header,24 Position Straight, Solder-to-Board, Narrow Body PDF

    SG-BGA-7026 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SG-BGA-7026
    		Ironwood Electronics High Density GHz BGA Sockets; Max Pincount: 400; Top Pitch (mm): 0.5; IC Array X: 20; IC Array Y: 20; Socket Lid: Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 0.96; IC Size X (mm): 11; IC Size Y (mm): 11; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.15; IC Ball Height Max (mm): 0.25; IC Ball Diameter Max (mm): 0.3; Max Package Code: Part Description: GHz BGA Socket (ZIF)-HD Original PDF 83.22KB 4