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    SG-BGA-6209 Search Results

    SG-BGA-6209 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202LF
    		Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    74221-201LF
    		Amphenol Communications Solutions 400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    84500-002
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84500-102
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84517-001
    		Amphenol Communications Solutions 200 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array PDF

    SG-BGA-6209 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SG-BGA-6209
    		Ironwood Electronics GHz BGA Sockets-0.8mm; IC Size X (mm): 15; IC Size Y (mm): 15; IC Array X: 18; IC Array Y: 18; Max Pincount: 324; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.55; IC Ball Height Max (mm): 0.5; IC Ball Height Min (mm): 0.3; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 0.132; Max Package Code: BGA324; Backing Plate: NO; Cavity Down: no; Heat Sink: no; IC Top Surface: Mold Cap; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF) Original PDF 91.19KB 4