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SG-BGA-6193
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Ironwood Electronics
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GHz BGA Sockets-1.27mm; IC Size X (mm): 35; IC Size Y (mm): 35; IC Array X: 26; IC Array Y: 26; Max Pincount: 676; Top Pitch (mm): 1.27; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.9; IC Ball Height Max (mm): 0.7; IC Ball Height Min (mm): 0.5; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 2.9; Max Package Code: BGA676; Backing Plate: yes; Cavity Down: no; Heat Sink: yes; IC Top Surface: Socket Lid: no; Part Description: GHz BGA Socket (ZIF) |
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