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    SG-BGA-6193 Search Results

    SG-BGA-6193 Result Highlights (3)

    Part ECAD Model Manufacturer Description Download Buy
    TPS3619-33DGKG4
    Texas Instruments Backup-Battery Supervisors for RAM Retention 8-VSSOP -40 to 85 Visit Texas Instruments Buy
    TPS3619-33DGK
    Texas Instruments Backup-Battery Supervisors for RAM Retention 8-VSSOP -40 to 85 Visit Texas Instruments Buy
    TPS3619-33DGKRG4
    Texas Instruments Backup-Battery Supervisors for RAM Retention 8-VSSOP -40 to 85 Visit Texas Instruments Buy

    SG-BGA-6193 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SG-BGA-6193
    Ironwood Electronics GHz BGA Sockets-1.27mm; IC Size X (mm): 35; IC Size Y (mm): 35; IC Array X: 26; IC Array Y: 26; Max Pincount: 676; Top Pitch (mm): 1.27; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.9; IC Ball Height Max (mm): 0.7; IC Ball Height Min (mm): 0.5; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 2.9; Max Package Code: BGA676; Backing Plate: yes; Cavity Down: no; Heat Sink: yes; IC Top Surface: Socket Lid: no; Part Description: GHz BGA Socket (ZIF) Original PDF 126.81KB 5