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    SG-BGA-6157 Search Results

    SG-BGA-6157 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202LF
    		Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    74221-201LF
    		Amphenol Communications Solutions 400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    84500-002
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84500-102
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84517-001
    		Amphenol Communications Solutions 200 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array PDF

    SG-BGA-6157 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SG-BGA-6157
    		Ironwood Electronics GHz BGA Sockets-0.8mm; IC Size X (mm): 14; IC Size Y (mm): 11; IC Array X: 17; IC Array Y: 12; Max Pincount: 136; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.1; IC Ball Diameter Max (mm): 0.5; IC Ball Height Max (mm): IC Ball Height Min (mm): 0.31; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 1.2; Max Package Code: BGA136; Backing Plate: no; Cavity Down: yes; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Screws; Part Description: GHz BGA Socket (ZIF)-Epoxy Original PDF 54.87KB 4