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SG-BGA-6157
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Ironwood Electronics
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GHz BGA Sockets-0.8mm; IC Size X (mm): 14; IC Size Y (mm): 11; IC Array X: 17; IC Array Y: 12; Max Pincount: 136; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.1; IC Ball Diameter Max (mm): 0.5; IC Ball Height Max (mm): IC Ball Height Min (mm): 0.31; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 1.2; Max Package Code: BGA136; Backing Plate: no; Cavity Down: yes; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Screws; Part Description: GHz BGA Socket (ZIF)-Epoxy |
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