|
SG-BGA-6053
|
|
Ironwood Electronics
|
GHz BGA Sockets-1.27mm; IC Size X (mm): 42.5; IC Size Y (mm): 42.5; IC Array X: 33; IC Array Y: 33; Max Pincount: 560; Top Pitch (mm): 1.27; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.9; IC Ball Height Max (mm): 0.7; IC Ball Height Min (mm): 0.5; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 1.7; Max Package Code: BGA560A; Backing Plate: yes; Cavity Down: yes; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF) |
Original |
PDF
|
92.86KB |
4 |