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    SG-BGA-6026 Search Results

    SG-BGA-6026 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    2SC6026MFV
    		Toshiba Electronic Devices & Storage Corporation NPN Bipolar Transistor / VCEO=50 V / IC=0.15 A / hFE=120~400 / VCE(sat)=0.25 V / SOT-723 Datasheet
    84512-202LF
    		Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    74221-201LF
    		Amphenol Communications Solutions 400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    84500-002
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84500-102
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF

    SG-BGA-6026 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SG-BGA-6026
    		Ironwood Electronics GHz BGA Sockets-0.8mm; IC Size X (mm): 10; IC Size Y (mm): 10; IC Array X: 10; IC Array Y: 10; Max Pincount: 100; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.12; IC Ball Diameter Max (mm): 0.55; IC Ball Height Max (mm): 0.45; IC Ball Height Min (mm): 0.35; IC Size Tolerance (mm): 0.1; IC Total Height Max (mm): 1.4; Max Package Code: BGA100; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: ZIF (screw); Part Description: GHz BGA Socket (ZIF) Original PDF 41.67KB 3