SG-BGA-6002 Search Results
SG-BGA-6002 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| 84516-002LF |
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200 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free | |||
| 84516-002 |
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200 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array | |||
| TLK6002ZEU |
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Dual Channel 0.47Gbps to 6.25Gbps Multi-Rate Transceiver 324-BGA -40 to 85 |
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| TMS320C28342ZEPQ |
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Delfino Microcontroller 256-BGA |
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| TMS320C28344ZEPQ |
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Delfino Microcontroller 256-BGA |
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SG-BGA-6002 Datasheets (1)
Ironwood Electronics
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SG-BGA-6002 | Ironwood Electronics | GHz BGA Sockets-0.8mm; IC Size X (mm): 13; IC Size Y (mm): 13; IC Array X: 15; IC Array Y: 15; Max Pincount: 225; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.12; IC Ball Diameter Max (mm): 0.55; IC Ball Height Max (mm): 0.4; IC Ball Height Min (mm): 0.25; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 2.5; Max Package Code: BGA225E; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: ZIF (screw); Part Description: GHz BGA Socket (ZIF) | Original | 61.97KB | 3 |