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    SD-5513-003 Search Results

    SD-5513-003 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    68655-131HLF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 7.37 mm (0.29in) Tail. PDF
    68655-135HLF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 7.37 mm (0.29in) Tail. PDF
    68655-133HLF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 7.37 mm (0.29in) Tail. PDF
    68655-136
    		Amphenol Communications Solutions BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch. PDF
    68655-132HLF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 7.37 mm (0.29in) Tail. PDF