SAC387
Abstract: SAC387 solder Multicore 96SC SAC-387 QQ-S-571 MSDS J-STD-006 sac387 97SC Loctite 510 henkel solder J-STD-006 SAC305
Contextual Info: Technical Data Sheet 96SC and 97SC Alloy February 2005 Lead Free Solder Alloys for Electronics PRODUCT DESCRIPTION MULTICORE 96SC and 97SC alloys are designed to be lead free substitutes for tin/lead alloys in all electronics assembly soldering operations. Some advantages of MULTICORE®
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QQ-S-571,
J-STD-006
SAC387
SAC387 solder
Multicore 96SC
SAC-387
QQ-S-571 MSDS
J-STD-006 sac387
97SC
Loctite 510
henkel solder
J-STD-006 SAC305
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SAC387
Abstract: BS219 SAC387 solder multicore solder wire Multicore 96SC 97Cu3 LMP62 solder wire HMP Loctite 414 MSDS Multicore savbit
Contextual Info: Technical Data Sheet Properties of Alloys of Multicore Solder Wires August 2007 # This data sheet lists the most popular solders supplied as flux-cored wire and can be used in addition to the separate Technical Data Sheets for Multicore cored solder wire fluxes.
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SAC387
Abstract: IPC-SF-818 J-STD-004 solder wire rom1 C502 Multicore 96SC J-STD-004 sn60 henkel solder TR-NWT-000078 SAC387 solder J-STD-004 MSDS
Contextual Info: Technical Data Sheet C502 December-2009 PRODUCT DESCRIPTION C502 provides the following product characteristics: Technology Activity Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Solder wire - Cored Medium • No clean • Clear residue
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December-2009
IPC/J-STD-004
SAC387
IPC-SF-818
J-STD-004 solder wire rom1
C502
Multicore 96SC
J-STD-004 sn60
henkel solder
TR-NWT-000078
SAC387 solder
J-STD-004 MSDS
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PDF
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IPC-SF-818
Abstract: SAC387 SAC305 C400TM SAC387 solder J-STD-004 MSDS EN29454-1 TR-NWT-000078 Multicore SOLDER Multicore 96SC
Contextual Info: Technical Data Sheet C400 October-2009 PRODUCT DESCRIPTION C400™ provides the following product characteristics: Technology Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire • Halide free • No clean • Clear residue
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C400TM
October-2009
C400TM
IPC/J-STD-004
IPC-SF-818
SAC387
SAC305
SAC387 solder
J-STD-004 MSDS
EN29454-1
TR-NWT-000078
Multicore SOLDER
Multicore 96SC
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IPC-SF-818
Abstract: SAC387 SAC387 solder
Contextual Info: Technical Data Sheet C511 October-2009 PRODUCT DESCRIPTION C511™ provides the following product characteristics: Technology Activity Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire High • No clean • Clear residue
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October-2009
IPC/J-STD-004
IPC-SF-818
SAC387
SAC387 solder
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SAC387 solder
Abstract: SAC387
Contextual Info: Technical Data Sheet C400 April-2011 PRODUCT DESCRIPTION C400 provides the following product characteristics: Technology Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire • Halide free • No clean • Clear residue
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April-2011
IPC/J-STD-004
SAC387 solder
SAC387
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SAC387
Abstract: NXR-1400 tamura solder paste SN63 PB37 alpha PowerPAK 1212-8 stencil ekra e5 SAC387 solder MIL-STD-750 method 1037 UP78 SAC-387
Contextual Info: VISHAY SILICONIX Power MOSFETs Application Note 914 "PowerPAK 1212-8", The Proven Automotive Package By Kandarp Pandya INTRODUCTION This application note presents useful information on the PowerPAK 1212-8 to facilitate SQE and design engineers. Vishay introduced the PowerPAK power MOSFET package
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1990s
AN825
17-May-10
SAC387
NXR-1400
tamura solder paste
SN63 PB37 alpha
PowerPAK 1212-8 stencil
ekra e5
SAC387 solder
MIL-STD-750 method 1037
UP78
SAC-387
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73494
Abstract: NXR-1400 ekra e5 ekra nicolet nxr1400 pyramax tamura solder paste IPC-9701 nicolet SAC387
Contextual Info: AN611 Vishay Siliconix Development of a Lead Pb -Free Soldering Process for PolarPAK By Kandarp Pandya ABSTRACT PolarPAK is one of the latest Vishay Siliconix SMD packages with enhanced thermal efficiency. Heat from the semiconductor MOSFET chip is removed from
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AN611
15-mm
31-Aug-05
73494
NXR-1400
ekra e5
ekra
nicolet nxr1400
pyramax
tamura solder paste
IPC-9701
nicolet
SAC387
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PDF
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SAC387
Abstract: CM14013 SAC387 solder CSPEMI307A SAC-387
Contextual Info: 4-Channel ESD/EMI Filter Array Plus 4-Channel ESD Array for USB CM1401-32CP Features • • • • • • • • • • • Functionally and pin-compatible with CSPEMI307A device OptiGuard coated for improved reliability at assembly Four channels of combined EMI/RFI filtering +
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CM1401-32CP
CSPEMI307A
15-bump,
960mm
330mm
SAC387
CM14013
SAC387 solder
SAC-387
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SAC387
Abstract: IPC-7525 pcb warpage in ipc standard land pattern for WLCSP "x-ray machine" ROSIN FLUX TYPE ROL0 WLCSP stencil design FDZ191P sac105 IPC-9075
Contextual Info: www.fairchildsemi.com AN-6084 Surface Mount Assembly Guideline for WLCSP 1.0x1.5 Introduction The Wafer-Level Chip-Scale Package WLCSP is one of the smallest discrete MOSFET devices available in the market. Fairchild’s offering comes in two ultra-low profile
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AN-6084
SAC387
IPC-7525
pcb warpage in ipc standard
land pattern for WLCSP
"x-ray machine"
ROSIN FLUX TYPE ROL0
WLCSP stencil design
FDZ191P
sac105
IPC-9075
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tamura tlf-206-93f
Abstract: p10 LED matrix single color module CANADA ICES 003. CLASS B mother board tamura tlf sac305 S131CL-5-RMM-2450S tamura solder paste SAC305 indium MMCX connector Sn 4011 SAC387 solder
Contextual Info: PRELIMINARY DATA SHEET MATRIX Transceiver Modules ZMXM-400 Series Integrated Transceiver Module for ZigBee / IEEE 802.15.4 Evaluation Kits available DESCRIPTION The Matrix module is a 2.4 GHz IEEE 802.15.4 RF transceiver providing a cost- effective solution for data links and wireless networks. The module design is
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ZMXM-400
100mW,
tamura tlf-206-93f
p10 LED matrix single color module
CANADA ICES 003. CLASS B mother board
tamura tlf sac305
S131CL-5-RMM-2450S
tamura solder paste
SAC305 indium
MMCX connector
Sn 4011
SAC387 solder
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73507
Abstract: IPC-9701 IPC-A-610D ekra e5 SAC387 tamura tlf tamura solder paste Cold solder joint pyramax mosfet so8 smd
Contextual Info: AN610 Vishay Siliconix PolarPAK Solder Joint Reliability Based on Thermal Fatigue IPC-9701 By Kandarp Pandya ABSTRACT PolarPAK, a thermally enhanced package from Vishay Intertechnology, facilitates MOSFET heat removal from an exposed top metal lead-frame connected to a
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AN610
IPC-9701
IPC-9701
31-Aug-05
73507
IPC-A-610D
ekra e5
SAC387
tamura tlf
tamura solder paste
Cold solder joint
pyramax
mosfet so8 smd
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tamura tlf-206-93f
Abstract: SAC387 IPC-7711 Tamura kaken TLF-206-93F tamura solder paste tamura tlf tamura No clean solder paste S131CL-5-RMM-2450S TLF 206-93F lead free
Contextual Info: MATRIX TRANSCEIVER MODULES ZMXM-400 Series Integrated Transceiver Module for ZigBee / IEEE 802.15.4 Evaluation Kits available DESCRIPTION The Matrix module is a 2.4 GHz IEEE 802.15.4 RF transceiver providing a cost- effective solution for data links and wireless networks. The module design is
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ZMXM-400
100mW,
tamura tlf-206-93f
SAC387
IPC-7711
Tamura kaken
TLF-206-93F
tamura solder paste
tamura tlf
tamura No clean solder paste
S131CL-5-RMM-2450S
TLF 206-93F lead free
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p10 LED matrix single color module
Abstract: tamura tlf-206-93f ZMXM-400 SAC-387
Contextual Info: MATRIX Transceiver Modules ZMXM-400 Series Integrated Transceiver Module for ZigBee / IEEE 802.15.4 N O T FO R R EC N O EW M M D EN ES D IG ED N Evaluation Kits available DESCRIPTION The Matrix module is a 2.4 GHz IEEE 802.15.4 RF transceiver providing a cost-
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ZMXM-400
100mW,
p10 LED matrix single color module
tamura tlf-206-93f
SAC-387
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