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DLP670SFYR
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Texas Instruments
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DLP® 0.67-inch, 2716x1600 array, S610 digital micromirror device (DMD) 350-CPGA 0 to 70 |
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92634-106HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 6 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail. |
PDF
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51704-10601606C0LF
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Amphenol Communications Solutions
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PwrBlade®, Power Connectors, 6P 16S 6P Vertical Header, Press Fit |
PDF
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68024-106HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 6 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail. |
PDF
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68464-106HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch. |
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