S13N30S Search Results
S13N30S Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
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Contextual Info: RN ICPAK N uaant Specifications for TSOP Sockets MATERIALS Body: Liquid crystal polymer Plating: TT = 2.03 pm 80 pinch Tin/Lead overall. 1.27 pm (50 pinch) Nickel underplate. Frame: Glass-filled PPS Contact: Copper alloy Holder: Copper alloy Flammability: UL 94V-0 |
OCR Scan |
490m/s2 98m/s2 TSOP-4050XX-SMT-TT S13N30S TSOP-28XX-SMT-TT TSOP-32XX-SMT-TT TSOP-40XX-SMT-TT |