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    S-03142 Search Results

    S-03142 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    68031-424HLF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 24 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail. PDF
    68031-420HLF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail. PDF
    130-3142-11H
    		Amphenol Communications Solutions Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP. PDF
    68031-421HLF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail. PDF
    68031-429HLF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail. PDF