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78511-109HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch. |
PDF
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54111-109061700LF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch. |
PDF
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10114829-11109LF
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Amphenol Communications Solutions
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1.25mm Wire to Board Wafer, Vertical, Through Hole, 9 Positions |
PDF
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10005639-11109LF
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Amphenol Communications Solutions
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Vertical Through-Hole 240 Position DDR2 DIMM Connector, 1.00mm pitch |
PDF
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94611-109HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions, 2.54 mm (0.100in) Pitch. |
PDF
|
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