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10127820-0222LLF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 2 Positions, LCP, GW Compatible, Tray Packing. |
PDF
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68002-225HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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68002-223HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 23 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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68002-222HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 22 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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10127820-0222LPLF
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Amphenol Communications Solutions
|
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 2 Positions, LCP, GW Compatible, Tray Packing, With Pegs. |
PDF
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