ROHS LABELLING NOTE Search Results

Contextual Info: NOTE:1. THE ''LF'' PRODUCTS MEET EUROPEAN UNION DIRECTIVES AND OTHER COUNTRY REGULATIONS AS DESCRIBED IN GS-22-008. 2. LEAD FREE OR RoHS DIRECTIVE LABELLING TO BE PROVIDED AS PER GS-14-920 FOR LEAD FREE VERSION. PDM: Rev:D STATUS: Released Printed: May 14, 2011.

Contextual Info: NOTE:1. THE ''LF'' PRODUCTS MEET EUROPEAN UNION DIRECTIVES AND OTHER COUNTRY REGULATIONS AS DESCRIBED IN GS-22-008. 2. LEAD FREE OR RoHS DIRECTIVE LABELLING TO BE PROVIDED AS PER GS-14-920 FOR LEAD FREE VERSION. PDM: Rev:E STATUS: Released Printed: May 14, 2011.

EIA standards 783

Abstract: smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code
Contextual Info: AN1235 Application note IPAD 500 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 500 µm pitch Flip Chips. For information on 400 µm Flip Chips, see Application note AN2348.

AN2348

Abstract: EIA standards 763 EIA 481-C flip chip bga 0,8 mm WLCSP stencil design EIA 763 Service Manual smd rework station WLCSP chip mount WLCSP flip chip BUT12
Contextual Info: AN2348 Application note IPAD 400 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 400 µm pitch Flip Chips. For information on 500 µm Flip Chips, see Application note AN1235.

REGULATOR IC FOR 3-VOLTS POSITIVE OUTPUT

Abstract: n136 BLUECORE serial GR2320 CAMBRIDGE SILICON RADIO SD7GR2316 6022A-GR2316 BlueCore 2 External BlueCore 6 flash schematic diagram of bluetooth headsets
Contextual Info: GR2316 / GR2320 Module GR2316 / GR2320 Data Sheet Features Description • Compliant to the Bluetooth® specifications v1.2 and v1.1 • RoHS compliant see Ordering Information on page 12 • FCC, CE, Industry Canada, Australia certified • Class 2 operation

Contextual Info: 2I3 LEADED PRODUCT NUMBER RoHs COMPATIBLE PRODUCT NUMBER 5 4 1 1 1- X X X X X X X X X LF _ JR PLATING C_ = 0.76pm GOLD/GXT ON CONTACT AREA 2pm MIN MAHE TIN ON TAIL OVER 1.27pm Ni MIN INDICATES THE PRODUCT IS RoHS COMPATIBLE, NOTE 8 -TOTAL NB OF POSITIONS

Contextual Info: r 4 2 I3 LEADED PRODUCT NUMBER RoHs COMPATIBLE PRODUCT NUMBER 541 21 —X X X X X X XX X LF PLATING JT1 0.76pm GOLD/GXT ON CONTACT AREA 2pm MIN MATTE TIN ON TAIL OVER 1.27pm Ni MIN TX TOTAL NB OP POSITIONS 02 TO 36 OAL A NOTES: 1. HOUSING MAT’L : HIGH TEMPERATURE

Contextual Info: Datenblatt OMNIMATE Signal - series BL/SL 5.08 SL-SMT 5.08/02/180G 3.2SN BK BX Weidmüller Interface GmbH & Co. KG Klingenbergstraße 16 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com High-temperature-resistant male header, packed in box

Contextual Info: 2 |3 LEADED PRODUCT NUMBER RoHs COMPATIBLE PRODUCT NUMBER 541 1 2 —XXXXXXXXXLF PLATING AS AVAILABLE 5 4 1 1 2 —XXX—XX—XXXX INDICATES THE PRODUCT IS RoHS COMPATIBLE SEE NOTE 8 0 .7 6pm GOLD/GXT ON CONTACT AREA 2pm MIN MATTE TIN ON TAIL OVER 1.27pm Ni MIN

Contextual Info: r 1 LEADED PRODUCT NUMBER RoHs COMPATIBLE PRODUCT NUMBER 5 4 1 2 2 —X X X X X X X X X X LF PLATING _ r _ R : RETENTIVE LEG NOTE 8 8 = 0.38pm GOLD/GXT ON CONTACT AREA 2pm MIN MATTE TIN ON TAIL OVER 1.27pm Ni MIN .STACK HEIGHT, NOTE 6 -TOTAL NB OE POSITIONS

WLCSP66

Abstract: PI0297 EIA-481-C EIA 481-C WLCSP64 WLCSP underfill WLCSP stencil design comintec onyx32 smd code marking wlcsp 9
Contextual Info: PI0297 Package Information Description of WLCSP for microcontrollers and recommendations for use Introduction This document describes the WLCSP wafer level chip size package , and provides recommendation on how to use it. Only WLCSP for microcontrollers are described herein.

Contextual Info: D-sub Connector Assembly Hoods with Right-angle Connecting Cable XM2S Popular D-sub Connector Assembly Hood Now with Right-angle Connecting Cable for More Efficient Use of Space. • Right-angle cable removal. ■ Metallized plastic Hood provides excellent noise

Relimate 3 Pin

Abstract: 67095-002 Relimate 2 Pin 67095-003LF 67095-002LF relimate GS14 Relimate "5 Pin" 67095-060LF Relimate 10 pin
Contextual Info: 67095-098/ 67095-098LF NOTE 7 20.0 67095-089 / 67095-089LF 15 40.0 67095-063 / 67095-063LF 7 20.0 3 5 15.0 67095-088 / 67095-088LF 14 37.5 67095-062 / 67095-062LF 6 17.5 67095-094/ 67095-094LF 20 52.5 67095-087 / 67095-087LF 13 35.0 67095-061 / 67095-061LF

Contextual Info: Datenblatt OMNIMATE Signal - series BC/SC 3.81 SC-SMT 3.81/05/180G 3.2SN BK BX Weidmüller Interface GmbH & Co. KG Klingenbergstraße 16 D-32758 Detmold Germany Fon: +49 5231 14-0 Fax: +49 5231 14-292083 www.weidmueller.com High-temperature-resistant pin header SC-SMT 180G in

Contextual Info: Evaluation Board User Guide UG-133 One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Differential Receiver Evaluation Boards for Amplifiers Offered in 8-Lead SOIC and MSOP Packages

UG112

Contextual Info: Evaluation Board User Guide UG-112 One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Evaluation Board for Single, High Speed Op Amps Offered in 5-Lead SC-70 Packages FEATURES

Contextual Info: 1 2 3 31.00 +0.15 -0.10 4 6.08 +0.25 24.99 0.10 14.73 0.20 4.40 UNC THREAD 3.35 A 7.45 +0.15 -0.05 12.55 +0.07 -0.20 7.89 0.10 A 2.90 +0.20 -0.30 B 6.0 0.1 0.36 TRUE POSITIONING : 16.96 0.10 0.55 x0.45 2.80 +0.03 -0.05 PCB CARD DRILLING DIMENSIONS B & PAD RECOMMENDED

ic a91 alternative

Contextual Info: Data Sheet: JN5168-001-Myy JenNet-IP, ZigBee PRO and IEEE802.15.4 Module Overview The JN5168-001-Myy family is a range of ultra low power, high performance surface mount modules targeted at IEEE 802.15.4, JenNet-IP, ZigBee Light Link, ZigBee Smart Energy and

10UF

Abstract: C0805 R0805 3528 smt
Contextual Info: Evaluation Board User Guide UG-111 One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Universal Evaluation Board for Quad, High Speed Op Amps Offered in 14-Lead SOIC Packages

C1206

Abstract: R1206 SC70-5 SC-70 package
Contextual Info: Evaluation Board User Guide UG-112 One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Universal Evaluation Board for Single, High Speed Op Amps Offered in SC-70 Packages FEATURES

C0805

Abstract: C3548 R0805 dIs1 diagrams
Contextual Info: Evaluation Board User Guide UG-114 One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Universal Evaluation Board for Triple, High Speed Op Amps Offered in 14-Lead SOIC Packages

Contextual Info: Evaluation Board User Guide UG-111 One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Evaluation Board for Quad, High Speed Op Amps Offered in 14-Lead SOIC Packages The 2-layer evaluation board accepts SMA edge-mounted

Contextual Info: 1 2 3 A 4 6.08 +0.25 B D 4.40 UNC THREAD 3.35 A 7.45 +0.15 -0.05 12.55 +0.07 -0.20 7.89 #0.10 A C 2.80 +0.03 -0.05 0.55 x0.45 PCB CARD DRILLING DIMENSIONS ALL HOLES 0.13 Copyright FCI. C SECTION SHELL P/N LEAD FREE 09 D09S24B6RX011LF 25 D25S24B6RX011LF PAD

Contextual Info: 1 2 3 A 4 6.08 +0.25 B D 4.40 UNC THREAD 3.35 A 7.45 +0.15 -0.05 12.55 +0.07 -0.20 7.89 #0.10 A C 2.80 +0.03 -0.05 0.55 x0.45 PCB CARD DRILLING DIMENSIONS ALL HOLES 0.13 Copyright FCI. C SECTION SHELL P/N LEAD FREE 09 D09S24B6RX011LF 25 D25S24B6RX011LF PAD