ROBINSON NUGENT SOCKET Search Results

Contextual Info: FINE PITCH SOCKETS Surface Mount Sockets SOCKETS The Robinson Nugent family of surface mount sockets offers a wide variety of packaging solutions to ad­ dress the most difficult, high density, low profile socketing requirements. The RN family of SMT sockets is

Robinson Nugent idh

Abstract: IDH-16PK
Contextual Info: Robinson — Nugent Solderless Backplane Connectors Low Profile Press Fit Headers .025 IDH-LP Series • Designed for applications where space is critical • FLEXPRESS compliant pins permit solderless mounting • Fool-proof socket polarization • Optional ROBEX® betterthan-gold plating

LM 3883

Abstract: Robinson Nugent socket 16 pin
Contextual Info: Robinson 50 Mil Connectors Nugent Low Profile 2-Piece Connectors — — P50L Series * Low profile .276" - .472" 7-12mm mated heights to address board stacking applications * Eight sizes, 20-120 contacts * High-temp insulator compatible with IR and wave soldering

Contextual Info: 4 Row HDC Headers Robinson ~Nugent — PCB/Backplane Headers Single and Dual Bay HDC - H4 Series • High density up to 320 contacts single bay and 488 contacts dual bay • Dual FLEXPRESS contacts are front and rear repairable pages 339-340 for contact data

Contextual Info: RN PAK-50 IDC CONNECTORS P50E Series Standard .100" and .050" connectors used on one cable to accommodate backward and forward compatibility 3-dimensional mating Latching eject mechanism facilitates mating and unmating Accepts 28 AWG Cable Utilizes Robinson Nugent flat cable

DIN 34 STANDARD

Abstract: 96 pin DIN connector right angle apple 30 pin connector DIN-96CPC-XXX-TR Robinson Nugent idc DIN-96CPC-SR14A-TR
Contextual Info: Robinson 2-Piece PC Nugent- Connectors Standard C-Form DIN Solder-To-Board Plug Connectors DIN-CP Series # 96 position connector used on VME, VXI, Multi-Bus II daughter cards • High temp SMT compatible insulator * EMLB groundng contacts allow “hot board’

Robinson Nugent

Contextual Info: 4 ROW HDC SOCKETS Robinson Nugent PCB/Backplane Sockets, Vertical Mount Single Bay HDC - R4 Series Ideal for parallel PCB stacking memmaÆSÊÊÊÊÊÊÊ 1IÉII1 High density interconnect for a variety of computer, telecom and high speed electronic equipment

P50E-080S-TG

Abstract: P25E-050S-TG P50E-080P1 DIN-64-CPB-SR1-TR P50E-080P1-S1-TG DIN-64CPB-SR1-TR P25E-080S-TG 9063256 P50E-100S-TG DIN-96CPC-SR1-TR
Contextual Info: Robinson Nugent PC Boardmount Connectors and Sockets CPCI PAK-2¨ Connectors Compact PCI Connectors RN PAK-50¨ P25E and P50E Series 50 MIL IDC Sockets Two piece 2 mm ´ 2 mm pin and receptacle connector system. Meets IEC61076-4-101 Level 11 requirements and

DIN-48RPC-DPS-XXXX

Abstract: DIN-96RPC-DPS-XXXX Robinson Nugent cable to board
Contextual Info: Robinson Nugent 2-Piece PC Connectors .Inverse R-Form DIN ^Press-fit Backpanel Plug Connectors DIN-RP Series FLEX PRESS press-fit contacts eliminate soldering * EMLB or grounding contacts for “hot board” replacement are set by application tooling at no additional cost see page 126

Contextual Info: DIMMPAK — Introduction to DIMS Robinson Nugent has developed a full range of Dual Inline Memory Sockets DIMSs to support increas­ ing demands for high density Dual Inline Memory Module (DIMM) technology. Our DIMS product series effectively provides a high density packaging system for designers of high speed, memory intensive

Robinson Nugent socket

Contextual Info: &QF7. HIGH DENSITY Introduction to DIMS Robinson Nugent has developed a full range of Dual Inline Memory Sockets DIMSs to support increas­ ing demands for high density Dual Inline Memory Module (DIMM) technology. Our DIMS product series effectively provides a high density packaging system for designers of high speed, memory intensive

Contextual Info: RN 1C PAK Surface Mount Sockets The Robinson Nugent family of surface mount sockets offers a wide variety of packaging solutions to ad­ dress the most difficult, high density, low profile socketing requirements. The RN family of SMT sockets is designed to address miniaturized prototype and production packaging applications for memory and control

Robinson Nugent socket

Contextual Info: So cket s HIGH DENSITY_ 8 Byte DIMM Sockets, DIMS Series Effectively provides double density packaging Durability - 60 cycles minimum Vertical entry allows insertion/removal without disturbing “neighboring DIMMs” Superior shock and vibration performance

robinson nugent

Abstract: straddle PCMCIA Robinson Nugent socket Robinson Nugent 2.0 Robinson Nugent 2.0 mm Robinson Nugent socket connector
Contextual Info: PCMCIA_ SELECTION GUIDE MEMPAK” Receptacles Part Number MCS 068 SM A 1 TP TR30 .Contact Plating TR30-30 microinch ROBEX Memory Card Socket. Number of Contacts. 68 Position Body Style_ SM-Straddle Mount SS-Single sided, Single row SD-Single sided, Dual row

Robinson Nugent s2

Contextual Info: FINE PITCH SOCKETS E & D _ Specifications for SOP Sockets MATERIALS Body & Frame: Glass reinforced PPS UL 94V-0 Contact: Copper Alloy Plating: TT = 2.03 pm (80 pinch) Tin/Lead overall. 1.27 pm (50 pinch) Nickel underplate. ELECTRICAL Current Rating: 0.5 Ampere per contact

Robinson Nugent socket

Abstract: ROBINSON NUGENT
Contextual Info: HIGH DENSITY_ 8 Byte DIMM Sockets, DIMS Series * Effectively provides double density packaging 9 Durability - 60 cycles minimum 9 Vertical entry allows insertion/removal without disturbing “neighboring DIMMs” RN DIMMPAK 9 Superior shock and vibration performance

Robinson Nugent idh

Abstract: Robinson Nugent idc robinson nugent Robinson Nugent socket Robinson Nugent IDC board mount connectors
Contextual Info: HEADERS Low Profile Headers .025” sq. Post IDH-LP Series • Designed for applications where space is critical • Fool-proof socket polarization • Optional ROBEX betterthan-gold plating For Recommended PC Board Layout See Page 351. .250 CABLE-TO-BOARD

Robinson Nugent

Contextual Info: HIGH DENSITY CONNECTORS PCB/Backplane Headers Single or Dual Bay HDC - H3 Series High density up to 240 contacts Dual FLEXPRESS contacts are front and rear repairable pages 172-175 for contact data) Mates with 3 row sockets EMLB grounding contacts allow “hot

Contextual Info: DIN CONNECTORS_ Standard C-Form DIN Press-fit Backpanel Socket Connectors DIN-CS Series * FLEXPRESS contacts permit solderless mounting * 96 position socket for VME, Multi-Bus II, and VXI Backpanels * Expanded sizes 120 and 150 position

Contextual Info: RN 1C PAK NuaGnt Specifications for PLCC-SMT, SOJ and PLCCE Sockets MATERIALS High tem perature thermoplastic Contacts: Phosphor Bronze Flammability: U L 94V-0 Plating: PLCC-SMT & SOJ PLCCE T T =150 pinch 3.81 p m minimum Tin/Lead on contact area. 200 pinch (5.08 pm ) minimum

Robinson Nugent socket

Abstract: Robinson Nugent socket 16 pin
Contextual Info: D Kl u A ri n IM r « i \ £ 2mm Sockets P2 Series High temp, surface mount compatible Right angle socket offers variable standoff heights and locator posts to address 2.5" disc drive requirements Top and bottom inverse entry option gives greater flexibility for PCB stacking

Contextual Info: HIGH DENSITY CONNECTORS PCB Sockets, Right Angle Mount Single or Dual Bay HDC - S4 Series High density up to 320 contacts single bay and 488 contacts dual bay * High temp insulator withstands IR reflow and wave soldering * Low 2 oz insertion force DIN/HDC

Contextual Info: HIGH DENSITY CONNECTORS_ PCB Plugs, Right Angle Mount Single Bay HDC - P3 Series * High density up to 240 contacts * Right angle mounting for extender boards BACKPLANE * Mates with 3 row single bay sockets How to Order HDC - P3 Series Sockets HDC — P 240 — 3

Robinson Nugent

Abstract: Robinson Nugent SCREW MACHINE SOCKET Motorola 68040
Contextual Info: HIGH DENSITY Pin Grid Array Socket with Heat Sink Tabs PGHS Series CLIP HEAT SINK • High temp molded insulator body compatible with IR and vapor phase soldering MICROPROCESSOR • Precision screw machine sockets for high reliability PGA SOCKET • “Ultra Low Force” 6-finger contact