GT30J110SRA
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Toshiba Electronic Devices & Storage Corporation
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IGBT, 1100 V, 60 A, Built-in Diodes, TO-3P(N) |
Datasheet
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77313-124-70LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 70 Positions |
PDF
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77317-804-70LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 70 Positions ,2.54mm (0.100in) Pitch, |
PDF
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77313-824-70LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 70 Positions |
PDF
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77313-424-70LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 70 Positions |
PDF
|
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