RESISTOR 6 OHM Search Results

tantalum nitride

Abstract: 100PPM
Contextual Info: Thin Film Resistor Chips Resistor Ordering System 4 Is the resistor value total % + tolerance See chart below 5) Is the 2nd resistor value total % ±tolerance if applicable) Example 1 2 3 4 5 6 7 8 MTR - 2R2K - SR2 - K - NA - G - 1 - T A + 0.5 Ohm F + 1%

Contextual Info: A CHECKLIST FOR ORDERING FILM RESISTORS COMPANY OF ^B 3EV ORDERS MUST HAVE COMPLETE INFORMATION INCLUDING THE FOLLOWING: 1. 2. 3. 4. 5. 6. Resistor type and model number Resistor wattage rating Resistor value Resistor tolerance Temperature Coefficient Special quantity of each item

Contextual Info: Metal Film Precision Resistor－CSR Series •Construction 5 2 3 4 6 1 ΦD K L 1 Insulation Coating 2 Trimming Line 3 Ceramic Rod 4 5 6 Electrode Cap Resistor Layer Marking ■Dimensions ■Features Unit: mm －Excellent overall stability Packaging Type L

resistor

Abstract: 27K resistor datasheet smsc pin diagram Super I/O what is pull up resistor
Contextual Info: APPLICATION NOTE 7.1 Revised 6/13/97 SMSC Super and Ultra I/O Design Tips Resistor Configuration Considerations By Bob Gross Even Numbered Jumper Selectable Super I/O Devices and Ultra I/O Resistor Configuration Issues • Pull Up and Down Resistor Considerations

thyristor BT 200

Contextual Info: ERICSSON $ April 1997 PBR 5111/6 LPC Line Resistor Network Description Key Features The Line Protection Resistor Network LPC PBR 5111/6 consists of a ratio matched pair of thickfilm resistors on a ceramic substrate. PBR 5111/6 is used in telephone line interface overvoltage protection networks, where the LPC resistors limit the

Contextual Info: Metal Film Leaded Precision Resistor－MFR Series •Construction 5 6 1 2 3 4 7 d H L 1 Insulation Coating Expose resin 2 Trimming Line 3 Ceramic Rod (Alumina ceramic) 4 Electrode Cap (Tinned iron cap) 5 6 7 Resistor Layer (Nickel alloy) Marking (Expose)

AR02

Contextual Info: Thin Film Precision Chip Resistor－AR Series •Construction L D1 W 3 4 5 6 T 9 D2 1 Alumina Substrate 2 Bottom Electrode Ag 3 Top Electrode (Ag-Pd) 4 5 6 871 7 8 9 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) 2 Resistor Layer (NiCr)

Contextual Info: Anti-Corrosive Thin Film Precision Chip Resistor－PR Series •Construction L D1 W 3 4 5 6 T 9871 D2 1 Alumina Substrate 2 Bottom Electrode Ag 3 Top Electrode (Ag-Pd) 4 5 6 2 7 8 9 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) Resistor Layer (NiCr)

RN06

Abstract: 4R70 RN20 resistor 5W 1Ohm RN06B
Contextual Info: Thin Film Precision Chip Resistor－RN Series •Construction L D1 W 3 4 5 6 T 9 D2 1 Alumina Substrate 2 Bottom Electrode Ag 3 Top Electrode (Ag-Pd) 4 5 6 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) 871 7 8 9 2 Resistor Layer (NiCr)

Contextual Info: Thin Film Precision Chip Resistor－RN Series •Construction L D1 W 3 4 5 6 T 9 D2 1 Alumina Substrate 2 Bottom Electrode Ag 3 Top Electrode (Ag-Pd) 4 5 6 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) 871 7 8 9 2 Resistor Layer (NiCr)

micrometrics resistor

Abstract: MCR-10RK-SR2-F-E-B-1-T 200RK 2r5k tantalum nitride MTR-2R2K-SR2-K-NA-G-1-T 100PPM
Contextual Info: Passive Components Resistor Ordering System EXAMPLE 1 2 3 4 5 67 8 MTR-2R2K-SR2-K-NA-G-1-T 6 Backing G GS B 1) is the three letter device type designation MTR Single Value through Chip Resistor Resistance top to bottom) Single Value Pad to Pad Chip Resistor

Contextual Info: POE International Corp SPECIFICATION OF LOW OHMIC CHIP RESISTOR M01-00-E-07 Ver: 1 Page: 1 of 6 ROHS compliance WW10X ±1%, ±5% Low ohmic chip resistors Size 1210 Customer Approval No Issue Date : : : Customer Approval : POE International Corp SPECIFICATION OF LOW OHMIC CHIP RESISTOR

viking CSR

Abstract: CSR1225
Contextual Info: CSR Series Current Sensing Chip Resistor MERITEK CONSTRUCTION L D1 W 3 4 5 6 T 9 8 7 1 2 D2 1 Alumina Substrate 2 Bottom Electrode Ag 3 Top Electrode (Ag-Pd) 4 5 6 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) 7 8 9 Resistor Layer (Ag/Pd)

CSR3720

Contextual Info: CSR Series Current Sensing Chip Resistor MERITEK CONSTRUCTION L D1 W 3 4 5 6 T 9 8 7 1 2 D2 1 Alumina Substrate 2 Bottom Electrode Ag 3 Top Electrode (Ag-Pd) 4 5 6 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) 7 8 9 Resistor Layer (Ag/Pd)

Contextual Info: Current Sensing Chip Resistor－CRS Series L •Construction D1 W 3 4 5 6 T 9 8 7 1 2 D2 1 Alumina Substrate 2 Bottom Electrode Ag 3 Top Electrode (Ag-Pd) 4 5 6 7 8 9 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) Resistor Layer (Ag/Pd)

Contextual Info: Current Sensing Chip Resistor－CS Series L •Construction D1 W 3 4 5 6 T 9 8 7 1 2 D2 1 Alumina Substrate 2 Bottom Electrode Ag 3 Top Electrode (Ag-Pd) 4 5 6 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) 7 Resistor Layer (Ag/Pd) 8 Primary Overcoat (Glass)

BCN318

Abstract: capacitor 16K BCN 16 4A capacitor BCN E6-E12 BCN318RB
Contextual Info: bi441 short form 2007 dev.qxd 14 6/26/07 8:59 AM Page 14 Fixed Resistors Thick Film Chip Resistor Arrays Resistor Arrays Model BCN 10 4 BCN 16 4 BCN 16 8 Industrial Style, Inches mm 0804 (2010) 1206 (3216) 1206 (3216) Standard Resistance Range, Ohms 10 to 1 Meg

R330

Abstract: IEC 62 code RESISTOR DPAC CR1206 R010 R015 R020 R030 R040 R050
Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application

475 50K 249

Abstract: R68 resistor R040 CR2512 R010 R015 R020 R030 R050 R065
Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application

CR1218

Abstract: CR0603 CR0805 CR1206 CR1210 CR2010 CR2030 CR2512
Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application

CR0805

Abstract: R010 R015 R020 R030 R040 R050 R065 R050 RESISTOR
Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application

E192

Abstract: CR1210
Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application

CR1218

Abstract: CR0603 CR0805 CR1206 CR1210 CR2010 CR2030 CR2512
Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application

106 25K 810 resistor

Abstract: CR2512 226 25K
Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application