RESIN COMPOUND Search Results

HG-2

Abstract: 3060A 7471A AES chips E.04
Contextual Info: Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Fe P Zn SOIC 150 mils 8 Pb-Free Molding Compound % of Compound Weight g 10 4.44 E-03 85 3.77 E-02 3 1.33 E-03 1.5 6.66 E-04

DSA0090625.txt

Contextual Info: 5.0 mm DIA LED LAMP 599R2GYW-CC REV:A / 0 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange

k2950

Abstract: IR 16713
Contextual Info: 5.0 mm DIA LED 540R2GY-CC LAMP REV:A / 0 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange

Contextual Info: 5.0 mm DIA LED LAMP REV:A / 1 520MY8C-f2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange

Contextual Info: 5.0 mm DIA LED LAMP REV:A / 1 520CG6C-f2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange

PA 0016

Abstract: 520LB7C D4463
Contextual Info: 5.0 mm DIA LED LAMP REV:A / 1 520LB7C-F2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange

d4515

Abstract: LED highlight
Contextual Info: 5.0 mm DIA LED LAMP REV:A / 0 520PG2C-F2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange

Contextual Info: 12X12mm SMD LED WITH CERAMIC SUBSTRATE Part Number: KT-1213WG9SX9/10 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Materials: Features Dimensions : 12mmX12mmX1.2mm Package : Ceramics High power lighting. Encapsulating resin : Silicone resin

JESD22-A120

Contextual Info: 12X12mm SMD LED WITH CERAMIC SUBSTRATE Part Number: KT-1213WG9SX9/10 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Materials: z Dimensions : 12mmX12mmX1.2mm Package : Ceramics z High power lighting. Encapsulating resin : Silicone resin

SB2336E-G

Contextual Info: SB2336E-G Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin

SSB2336

Contextual Info: SSB2336E-GD2 Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin

Contextual Info: SW2336E-H Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin

isopropyl alcohol

Abstract: B589
Contextual Info: SY2336-HA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin

Contextual Info: SY2336-GA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin

Contextual Info: SSB2336E-GD3 Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin

Contextual Info: SA2336-GA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin

Contextual Info: SA2336-GA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin

B1588

Contextual Info: SY2336-GA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin

Contextual Info: SW2336E-H Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin

Contextual Info: WT-U3A8TW-8538 TOP Mount Super Bright SMD LED Product Specifications Specification Material Quantity Resin White Silicone Resin Carrier tape EIA 481-1A specs Conductive black tape Reel EIA 481-1A specs Conductive black Label WT standard Paper Packing bag 220x240mm

Contextual Info: Materials Declaration Data Sheet ASDM_ASDMB QFN 2.5 x 2.0 mm 12.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating

Contextual Info: WT-U3A8TW-8539 TOP Mount Super Bright SMD LED Product Specifications Specification Material Quantity Resin Cool White Silicone Resin Carrier tape EIA 481-1A specs Conductive black tape Reel EIA 481-1A specs Conductive black Label WT standard Paper Packing bag

Q3-6646

Contextual Info: Materials Declaration Data Sheet ASEM_ASEMB QFN 3.2 x 2.5 mm 19.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating

Contextual Info: Materials Declaration Data Sheet ASFLM,ASFLMB QFN 5.0 x 3.2 mm 37.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating