RELIABILITY TESTING REPORT Search Results

TRANSISTOR A104b

Abstract: TRANSISTOR A107 EIAJ ED-4701 305 water pumping machine control schematic electromigration calculation for TTL smd transistor AIT AAAA series SMD transistor schematic diagram atom ED-4701 A103-C
Contextual Info: [ 3 ] Reliability Testing Contents 1. What is Reliability Testing . 1 1.1 Significance and Purpose of Reliability Testing. 1 1.2 1.3 Before Testing . 1

EIAJ-IC-121-17

Abstract: JESD22-A110 EIAJ-ED4701-D323 EIAJ-IC-121-18 MIL-STD-883 PRESSURE COOKER failure rate SM stress migration EIAJ-IC-121 JESD22A110
Contextual Info: Quality and Reliability Report 5. Reliability Testing The purpose of reliability testing is to ensure that The purpose of the high-temperature operating life products are properly designed and assembled by HTOL test is to determine the reliability of subjecting them to stress conditions that acceler-

max785cai

Abstract: MAX232A SO-16 MAX232CPE application sheet MAX232CPE MAX232AEPE MAX785 MAX232ACPE MAX241CWI LH101 MAX724CCK
Contextual Info: January 1999 Product Reliability Report This report presents the product reliability data for Maxim’s analog products. The data was acquired from extensive reliability stress testing performed in 1997/1998. It is separated into seven fabrication processes: 1

max785cai

Abstract: MAX6809 MAX232CPE MAX232CPE application sheet MAX232ACPE MAX232AEPE MAX691ACPE T 9722 MAX232ECPE MAX233 application notes
Contextual Info: January 1999 Product Reliability Report This report presents the product reliability data for Maxim’s analog products. The data was acquired from extensive reliability stress testing performed in 1997/1998. It is separated into seven fabrication processes: 1

DG302 to220

Abstract: MAX233 application notes zener 9514 MAX249 MAX238 9545 MAX232CPE application sheet max809 ICM7218AIPI MAX232 application notes
Contextual Info: November 1, 1996 RR-1J Product Reliability Report This report presents the product reliability data for Maxim’s analog products. The data was acquired from extensive reliability stress testing performed in 1995. It is separated into seven fabrication processes: 1 Standard

MAX785

Abstract: st 9635 DG302 to220 MAX232CPE MAX232 integrated chips IC 9637 MAX333 equivalent max232 MTBF calculation MAX232 mtbf st 9548
Contextual Info: December 1997 RR-1K Product Reliability Report This report presents the product reliability data for Maxim’s analog products. The data was acquired from extensive reliability stress testing performed in 1996. It is separated into seven fabrication processes: 1 Standard

max785

Abstract: DG302 to220 DG301 to220 st 9635 st 9548 MAX232 integrated chips max232 MTBF calculation MAX232 mtbf MAX333 equivalent MAX232ACPE
Contextual Info: December 1997 RR-1K Product Reliability Report This report presents the product reliability data for Maxim’s analog products. The data was acquired from extensive reliability stress testing performed in 1996. It is separated into seven fabrication processes: 1 Standard

DG302 to220

Abstract: MAX724 equivalent 9532 zener MAX233 application notes MAX7219 equivalent MAX232CPE application sheet MAX238 MX7226 MAX249 MAX485 application notes
Contextual Info: November 1, 1996 RR-1J Product Reliability Report This report presents the product reliability data for Maxim’s analog products. The data was acquired from extensive reliability stress testing performed in 1995. It is separated into seven fabrication processes: 1 Standard

MAX202, MAX232

Abstract: LTC902 icl8069 equivalent MAX8212 equivalent MAX705 equivalent 7912 TO3 PACKAGE MAX832 MX7543 Ic 9430 MAX232
Contextual Info: May 1, 1995 RR-1I Product Reliability Report This report presents the product reliability data for Maxim’s analog products. This data is a result of extensive reliability stress testing that we performed in 1994. It is separated into six fabrication processes: 1

Mil-Std-883 Wire Bond Pull Method 2011

Abstract: MIL-STD-883 Method 2010 pHEMT transistor RF MESFET S parameters MESFET 0.15 phemt p-hemt TGA8310 MIL-STD-883 method 2011 GaAs 0.15 pHEMT
Contextual Info: GaAs MMIC Space Qualification GaAs MMIC Testing TriQuint Semiconductor has advanced Lot Acceptance Testing LAT for High Reliability Applications of GaAs MMICs. A flowchart depicting the entire MMIC processing flow, including the Quality Conformance Inspection

MAX7845

Abstract: MAX232 MAX232 mtbf mar 9109 MAX333 equivalent MAX9690 equivalent scr 9117 maxim 9114 max232 specification MAX252 8 pin
Contextual Info: RR-1G Product Reliability Report This report presents the product reliability data for Maxim’s analog products. This data is a result of extensive reliability stress testing that we performed from 1990 to 1992. It is separated into four groups: Metal Gate

ic 9033

Abstract: MAX232 MAX333 equivalent max232 MTBF calculation MAX232 mtbf MAX7845 mar 9109 MAX9690 equivalent maxim 9114 MAX690CPA
Contextual Info: RR-1G Product Reliability Report This report presents the product reliability data for Maxim’s analog products. This data is a result of extensive reliability stress testing that we performed from 1990 to 1992. It is separated into four groups: Metal Gate

MAX232

Abstract: MAX1074 LTC902 MAX252 8 pin max232 MTBF calculation max232 specification MAX9687 38544 MAX9690 equivalent analog devices dg508 die
Contextual Info: December 1, 1994 RR-1H Product Reliability Report This report presents the product reliability data for Maxim’s analog products. This data is a result of extensive reliability stress testing that we performed from January 1990 to January 1994. It is separated into six

MAX232

Abstract: max232 specification MAX252 8 pin MAX9690 equivalent MAX584 max-232 38544 LTC902 max232 MTBF calculation MAX9687
Contextual Info: December 1, 1994 RR-1H Product Reliability Report This report presents the product reliability data for Maxim’s analog products. This data is a result of extensive reliability stress testing that we performed from January 1990 to January 1994. It is separated into six

Contextual Info: Engineering Manual HF212 Solder Paste Suitable for use with: Standard SAC Alloys High Reliability 90iSC Alloy Low Ag Alloys Contents 1. Product Description 2. Features & Benefits 3. Print Process Window 4. Print Abandon Time Testing 5. Slump Testing 6. Tack-Life Force

Contextual Info: High Reliability Chip - X7R 16Vdc to 10kVdc A range of MLC chip capacitors in Stable EIA Class II dielectric with special testing for long term reliability. They are designed for optimum reliability; burned in at elevated voltage and temperature, and 100% physically and electrically inspected

Contextual Info: High Reliability Chip - X7R 16Vdc to 10kVdc A range of MLC chip capacitors in Stable EIA Class II dielectric with special testing for long term reliability. They are designed for optimum reliability; burned in at elevated voltage and temperature, and 100% physically and electrically inspected to

103jg1k

Abstract: 103jg thermistor
Contextual Info: Reliability Testing HIGH TEMPERATURE STORAGE « Previous Continue » THERMISTOR/THERMISTOR ASSEMBLY ENVIRONMENTAL TEST REPORT Part Number: 103JG1K Part Description: Thermistor Test Identification Number: SO#: 37213 Test Specification: HIGH TEMPERATURE SOAK

Contextual Info: High Reliability Chip - C0G 16Vdc to 10kVdc A range of MLC chip capacitors in Ultra stable EIA Class I C0G, or NP0, dielectric with special testing for long term reliability. They are designed for optimum reliability; burned in at elevated voltage and temperature, and 100% physically and electrically

Contextual Info: High Reliability Chip - C0G 16Vdc to 10kVdc A range of MLC chip capacitors in Ultra stable EIA Class I C0G, or NP0, dielectric with special testing for long term reliability. They are designed for optimum reliability; burned in at elevated voltage and temperature, and 100% physically and electrically inspected

report on PLCC

Abstract: 7B9742 3G0329 TSOP Package MIL-M-38535 0B0027 2G0232
Contextual Info: PAGE 1 OF 6 ATMEL CORPORATION Tel: 408 441-0311 Fax:(408)436-4200 AT-27BV020 EPROM RELIABILITY DATA - 125°C OPERATING LIFE TEST (PLASTIC) - 150°C RETENTION BAKE (PLASTIC) - EXTENDED THERMAL SHOCK - 15 PSIG PRESSURE POT - EXTENDED TEMPERATURE CYCLING * This report was generated from AT-27BV020 reliability testing.

MIL-M-38535

Contextual Info: PAGE 1 OF 6 ATMEL CORPORATION Tel: 408 441-0311 Fax:(408)436-4200 AT-27BV256 EPROM RELIABILITY DATA - 125°C OPERATING LIFE TEST (PLASTIC) - 150°C RETENTION BAKE (PLASTIC) - 15 PSIG PRESSURE POT - EXTENDED TEMPERATURE CYCLING - EXTENDED THERMAL SHOCK * This report was generated from AT-27BV256 reliability testing.

USP2373

Contextual Info: Reliability Testing SALT WATER IMMERSION « Previous Continue » THERMISTOR/THERMISTOR ASSEMBLY ENVIRONMENTAL TEST REPORT Part Number: USP2373 Part Description: Thermistor Probe Test Identification Number: SO#: 31538 Test Specification: SPECIAL Test Condition s :

Contextual Info: No.:T1091 RELIABILITY TEST REPORT TEST REPORT Company ：RAIO TECHNOLOGY INC. Model Name ：RA8806 Date Received ：2008.01.21 Date Tested ：2008.01.29 TESTING LABORATORY IS ACCREDITED BY: IEC/IECQ 17025 certificate of independent test laboratory approval