Part Number
    Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    REFLOWING PROFILES LGA Search Results

    REFLOWING PROFILES LGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    LUSB3193002
    		Amphenol Communications Solutions Lockable USB 3.0, Right Angle, with locking latch, For IR Reflow Pin in Paste PDF
    68786-201
    		Amphenol Communications Solutions 1X2 LOW PROFILE JUMPER PDF
    68786-201LF
    		Amphenol Communications Solutions 1X2 LOW PROFILE JUMPER PDF
    68786-102
    		Amphenol Communications Solutions Low Profile Jumper , Single Row, 2 Positions, 2.54mm (0.100in) Pitch PDF
    68786-102LF
    		Amphenol Communications Solutions Low Profile Jumper , Single Row, 2 Positions, 2.54mm (0.100in) Pitch PDF

    REFLOWING PROFILES LGA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    IPC-7527

    Abstract: IPC-7525 koki solder paste IPC7527
    Contextual Info: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		101752C 01049A an100p AN100-10 434-0507CAwww IPC-7527 IPC-7525 koki solder paste IPC7527 PDF

    IPC-7527

    Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
    Contextual Info: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		101752C 01049A an100fb AN100-10 434-0507CAwww IPC-7527 LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT PDF

    IPC-7527

    Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
    Contextual Info: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2


    Original     		PDF

    schroff SPG

    Abstract: GST18 SATA disk controller SLT3-PAY-2F2U-14 schroff SPG 124
    Contextual Info: Main Catalog 24th Edition Main Catalog Schroff gmbh, Langenalber Strasse 96–100, D-75334 Straubenhardt WWW.PENTAIREQUIPMENTPROTECTION.COM Equipment Protection Solutions 24th Edition | October 2012 39601-641 2012 Pentair Equipment Protection 18002_Hauptkatalog_Schroff_Umschlag_AK03_EN.indd 1


    Original     		D-75334 schroff SPG GST18 SATA disk controller SLT3-PAY-2F2U-14 schroff SPG 124 PDF