REFLOW SOLDERING GUIDE Search Results

Reflow Soldering Guide

Abstract: berex
Contextual Info: BeRex Reflow Soldering Guide Application Note RF MMIC Innovator www.berex.com Classification: Reflow Soldering Document Number: Reflow61110 Revision code: 0.1 Reflow Soldering Guide for Surface Mount Devices Name Writer Date Signature BY KIM JH Bae OK Dr. Yoo

"Solid State Relay"

Contextual Info: • Solid State Relay : Lead-free part soldering conditions DIP6pin SMD / DIP8pin(SMD) ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time.

phototriac

Contextual Info: • Phototriaccoupler : Lead-free part soldering conditions SOP4pin ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice.

JEDEC J-STD-020d.1

Abstract: paste profile J-STD-020d.1 JEDEC SMT reflow profile Altera ROHS AN81 J-STD-020D J-STD-033
Contextual Info: Reflow Soldering Guidelines for Lead-Free and RoHS-Compliant Packages AN-353-3.0 Application Note This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow

SOP4

Contextual Info: • Photocoupler : Lead-free part soldering conditions DIP4pin SMD / DIP6pin(SMD) / DIP8pin(SMD) / DIP16pin(SMD) ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time.

JEDEC J-STD-020d.1

Abstract: GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE pcb warpage in ipc standard Soldering guidelines J-STD-020D pcb warpage* in smt reflow Lead Free reflow soldering profile BGA
Contextual Info: AN 353: Reflow Soldering Guidelines for Lead-Free Packages February 2009 AN-353-2.0 Introduction This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow

MFK Series

Contextual Info: Soldering Surface Mount Reflow Surface Mount Capacitors. Recommended Reflow Soldering Conditions The following conditions are recommended for reflow soldering of surface mount capacitors onto a glass epoxy circuit board of 90 x 50 x 0.8 mm with resist by cream solder (eutectic solder).

profile wave soldering

Contextual Info: yA V - y A TANTALUM CAPACITORS Soldering Methods SOLDERING METHODS Solid tantalum chip capacitors can be attached by wave soldering or reflow soldering methods. The reflow soldering method however has become more popular since this process has been developed specifically for SMT components. Hand soldering is not

Contextual Info: www.eLED.com EM2520SECK09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SECK09 Recommended Soldering Pattern Units : mm

Contextual Info: RECOMMENDED REFLOW CONDITION CONDUCTIVE POLYMER ALUMINUM SOLID CAPACITORS Surface Mount RECOMMENDED REFLOW SOLDERING CONDITION The following conditions are recommended for air or infrared reflow soldering PXA/PXseries onto a glass epoxy circuit board of 90B50B0.8mm

Contextual Info: www.eLED.com EM2520SYC09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SYC09 Recommended Soldering Pattern Units : mm

Contextual Info: www.eLED.com EM2520SEC09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SEC09 Recommended Soldering Pattern Units : mm

Contextual Info: www.eLED.com EM2520SYCK09 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first andsecond soldering process." EM2520SYCK09 Recommended Soldering Pattern Units : mm

Cu3Sn

Abstract: Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN
Contextual Info: AN10365 Surface mount reflow soldering description Rev. 02 — 26 July 2006 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.

Lead Free reflow soldering profile BGA

Abstract: AN10365 HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products
Contextual Info: AN10365 Surface mount reflow soldering description Rev. 01 — 24 May 2005 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.

Cu3Sn

Abstract: HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3 AN10365
Contextual Info: AN10365 Surface mount reflow soldering description Rev. 03 — 22 April 2008 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.

reflow profile

Contextual Info: TOKEN Typical RoHS Reflow Profile Typical RoHS Reflow Profile All Token RoHS-compliant parts are backward compatible with tin-lead soldering processes. Soldering temperature must be greater than 230°C to ensure proper melting of lead-free solder. For all soldering methods, the optimal reflow profile for a circuit board assembly is dependent on the solder

Cu3Sn

Abstract: ipc 610 non-wetting
Contextual Info: AN10365 Surface mount reflow soldering Rev. 6 — 30 July 2012 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and handling of NXP semiconductor packages.

pcb warpage in ipc standard

Abstract: pcb warpage* in smt reflow GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE Lead Free reflow soldering profile BGA reflow soldering profile BGA Altera lead free BGA PROFILING leaded AN-081
Contextual Info: Reflow Soldering Guidelines for Lead-Free Packages Application Note 353 July 2004, ver. 1.0 Introduction Reflow Soldering Process Considerations The recent directives and legislations by nations around the world have mandated elimination of lead usage in some sectors of the electronics

h25b

Abstract: MKA Series MFZ Series
Contextual Info: SURFACE MOUNT ALUMINUM ELECTROLYTIC CAPACITORS Functional polymer electrolyte capacitors RECOMMENDED REFLOW SOLDERING CONDITION The following conditions are recommended for air or infrared reflow soldering PX/PXAseries onto a glass epoxy circuit board of 90B50B0.8mm

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS CONDUCTIVE POLYMER ALUMINUM SOLID CAPACITORS Surface Mount RECOMMENDED REFLOW SOLDERING CONDITION The following conditions are recommended for air or infrared reflow soldering PXC/PXA series onto a glass epoxy circuit board of 90B50B0.8mm

Contextual Info: MQixnttns D10FL 83 4Max. 9.7Max. TYPE D10FL TYPE For Reflow Soldering Frequency Range: 1kHz ~ 1MHz Inductance Range: 1 0 - 1500pH Features • • • • Recommended patterns: Low profile SMD Type 4mm high Suitable for large current Suitable for reflow soldering

capacitor 47 nano

Contextual Info: X7R Dielectric Capacitance Range PREFERRED SIZES ARE SHADED SIZE 0201 0402 0603 0805 1206 Soldering Packaging Reflow Only All Paper Reflow Only All Paper Reflow/Wave All Paper Reflow/Wave Paper/Embossed Reflow/Wave Paper/Embossed 0.60 ± 0.03 0.024 ± 0.001

AN10896

Contextual Info: AN10896 Mounting and Soldering of RF transistors Rev. 2 — 13 Nov 2012 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages