REFLOW SOLDERING Search Results

Reflow Soldering Guide

Abstract: berex
Contextual Info: BeRex Reflow Soldering Guide Application Note RF MMIC Innovator www.berex.com Classification: Reflow Soldering Document Number: Reflow61110 Revision code: 0.1 Reflow Soldering Guide for Surface Mount Devices Name Writer Date Signature BY KIM JH Bae OK Dr. Yoo

delamination leadframe

Contextual Info: VISHAY ▼ Vishay Telefunken Reflow Soldering Reflow Solder Profile The recommended profile is shown in figure 2 Vishay Telefunken transceivers are surface mount devices and are designed to be assembled to printed circuit boards PCBs using reflow soldering. Possible

reflow soldering profile BGA

Abstract: reflow temperature bga BGA PROFILING bga rework
Contextual Info: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: Removal and replacement of BGA packages on printed circuit boards is fairly straightforward. However, reattachment or touch-up of BGA packages that have already

reflow soldering profile BGA

Abstract: BGA PROFILING solder joint bga warpage bga rework
Contextual Info: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: • Use caution when profiling to insure minimal temperature difference <15°C and preferably <10°C between components Removal and replacement of BGA packages on printed

MFK Series

Contextual Info: Soldering Surface Mount Reflow Surface Mount Capacitors. Recommended Reflow Soldering Conditions The following conditions are recommended for reflow soldering of surface mount capacitors onto a glass epoxy circuit board of 90 x 50 x 0.8 mm with resist by cream solder (eutectic solder).

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS WZ Chip Type, Wide Temperature Range High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec 230°C over 60 sec 2 times (φ8 x 6.2, φ10 × 10 : 1 time)

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS WH Chip Type, High Reliability High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering WH Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time)

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS WZ Chip Type, Wide Temperature Range High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec 230°C over 60 sec 2 times (φ8 x 6.2, φ10 × 10 : 1 time)

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS WH Chip Type, High Reliability High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering WH Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time)

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS WJ 5.5mmL Chip Type High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times WJ Chip type with 5.5mm height. Designed for surface mounting on high density PC board.

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS WJ 5.5mmL Chip Type High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times WJ Chip type with 5.5mm height. Designed for surface mounting on high density PC board.

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS WD Chip Type, Low Impedance High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ10 x 10, : 1 time) Chip type, low impedance temperature range up to +105°C.

WJ Series

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS WJ 5.5mmL Chip Type High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times WJ Chip type with 5.5mm height. Designed for surface mounting on high density PC board.

Contextual Info: ALUMINUM ELECTROLYTIC CAPACITORS WS Chip Type, High CV High Temperature 260°C Reflow series Corresponding with 260°C peak reflow soldering Recomended reflow condition : 260°C peak 5 sec. 230°C over 60 sec. 2 times (φ8 x 6.2, φ10 × 10 : 1 time) Chip type higher capacitance in large case size.

Systems

Abstract: systemtechnik 60352-5 component data SAC305 laser soldering through hole technology SAC305 DIN EN 60352-5 din mount pcb connector mini din 9 male
Contextual Info: Electronic Board Assembly ERNI Systems Technology Systems Solutions - a one stop shop - www.erni.com Contents ERNI Systems Technology Soldering Technologies SMT soldering - Reflow Soldering of Surface Mount Devices THR soldering - Through Hole Components, reflow soldered

Contextual Info: MINIATURE ALUMINUM ELECTROLYTIC CAPACITORS NSEV NSEV SERIES 85℃ Bi-polar, Lead Free Reflow Soldering. ◆FEATURES • Lead Free reflow soldering is available. • Available for high density mounting. • RoHS compliance. ◆SPECIFICATIONS Items Characteristics

Contextual Info: NSKV MINIATURE ALUMINUM ELECTROLYTIC CAPACITORS NSKV SERIES 105¡C Bi-polar, Lead Free Reflow Soldering. ♦FEATURES • Lead Free reflow soldering is available. • Available for high density mounting. ♦SPECIFICATIONS Items Characteristics Category Temperature Range

Cu3Sn

Abstract: Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN
Contextual Info: AN10365 Surface mount reflow soldering description Rev. 02 — 26 July 2006 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.

Contextual Info: SKV MINIATURE ALUMINUM ELECTROLYTIC CAPACITORS SKV SERIES 105¡C, Lead Free Reflow Soldering. ♦FEATURES • Load Life : 105°C 1000 hours. • Lead free reflow soldering is available. • Available for high density mounting. ♦SPECIFICATIONS Items Characteristics

SPI-240-15-T1

Contextual Info: Ordering number : EN6027 GaAs Infrared LED SPI-240-15-T1 SPI-240-15-T1 Ultraminiature photointerrupter supporting reflow soldering Darlington-transistor type Features • GaAs Infrared LED plus Darlington Phototransistor • Photo-Interrupter for reflow soldering

Rubycon Aluminum Electrolytic

Abstract: rubycon sev uaa 1300
Contextual Info: SEV MINIATURE ALUMINUM ELECTROLYTIC CAPACITORS SEV SERIES 85℃, Lead Free Reflow Soldering. ◆FEATURES • Case Dia φ3~φ18mm • Lead free reflow soldering is available. • Available for high density mounting. • RoHS compliance. ◆SPECIFICATIONS

GP1S33

Contextual Info: GP1S33 GP1S33 Subminiature, Reflow Soldering Type Photointerrupter • Features ■ Outline Dimensions 1. Ultra-compact package 2. PWB mounting type 3. High sensing accuracy Slit width : 0.3mm 4. Applying to reflow soldering Preheat : 160˚C within 120 seconds

Contextual Info: SEV MINIATURE ALUMINUM ELECTROLYTIC CAPACITORS SEV SERIES 85¡C, Lead Free Reflow Soldering. ♦FEATURES • Case Dia ø3~ø10mm • Lead free reflow soldering is available. • Available for high density mounting. ♦SPECIFICATIONS Items Characteristics Category Temperature Range

RUBYCON SKV

Contextual Info: SKV MINIATURE ALUMINUM ELECTROLYTIC CAPACITORS SKV SERIES 105℃, Lead Free Reflow Soldering. ◆FEATURES • Load Life : 105℃ 1000 hours. • Lead free reflow soldering is available. • Available for high density mounting. • RoHS compliance. ◆SPECIFICATIONS