R56 MAGNETIC Search Results

Contextual Info: 1/1 SMD Inductors(Coils) For Power Line(Wound, Magnetic Shielded) Conformity to RoHS Directive SPM Series SPM10040 SHAPES AND DIMENSIONS 11.5max. 4.0max. Terminal R56 30530 3.0 10±0.3 FEATURES • Low profile design Mount area: 10.0mm square Low profile: 4.0mm max. height

Contextual Info: 1/1 SMD Inductors(Coils) For Power Line(Wound, Magnetic Shielded) SPM Series SPM10040 SHAPES AND DIMENSIONS 11.5max. 4.0max. Terminal R56 30530 3.0 10±0.3 FEATURES • Low profile design Mount area: 10.0mm square Low profile: 4.0mm max. height • High power handling capability:

SPM100

Abstract: C550C
Contextual Info: 1/1 SMD Inductors(Coils) For Power Line(Wound, Magnetic Shielded) Conformity to RoHS Directive SPM Series SPM10040 SHAPES AND DIMENSIONS 11.5max. 4.0max. Terminal R56 30530 3.0 10±0.3 FEATURES • Low profile design Mount area: 10.0mm square Low profile: 4.0mm max. height

Contextual Info: C orpora te Hom e | Electronic Components | Se gm e nts | W ho W e Are My Account Searc h Products Documentation Resources My Account Customer Support Home > Products > By Type > C ircuit Protection Devices > Product Feature Selector > Product Details DXM1306-R56 Product Details

J-STD-002C

Abstract: T F 2 D 1R0 choke
Contextual Info: SMD POWER CHOKE COIL PIC1036HU SERIES 1. PART NO. EXPRESSION : PIC1036HU-R56MF a (b) (c) (d) (e) (f) (g) (a) Series code (e) Tolerance code : M = ±20% (b) Dimension code (f) F : RoHS Compliant (c) Type code (g) 11 ~ 99 : Internal controlled number (d) Inductance code : R56 = 0.56uH

Contextual Info: SMD Power Inductors - CPUS Series CPUS Series CPUS Series is designed for low RDC and ultra large current application. Its assembly model and magnetic shielding is suitable for high-density mounting.This series also provides customers with embossed carrier type packaging for automatic mounting

Contextual Info: SMD Power Inductors - CPUS Series CPUS Series CPUS Series is designed for low RDC and ultra large current application. Its assembly model and magnetic shielding is suitable for high-density mounting and ultra low buzz noise. Soldering conditions can be easily confirmed when mounting onto board.

Contextual Info: Multilayer Power Inductors 積層パワーインダクタ MDT2012-CH Recommended patterns 推奨パターン図 Unit: mm (Unit: mm) FEATURES 特長 • Miniature size: 2012 footprint (2.0mmx1.2mm) and low profile(1.0mm Max. Height)  Magnetically shielded

Contextual Info: Multilayer Power Inductors 積層パワーインダクタ MDT2012-CH Recommended patterns 推奨パターン図 Unit: mm (Unit: mm) FEATURES 特長 • Miniature size: 2012 footprint (2.0mmx1.2mm) and low profile(1.0mm Max. Height)  Magnetically shielded

Contextual Info: Multilayer Power Inductors 積層パワーインダクタ MDT2012-CR Recommended patterns 推奨パターン図 Unit: mm (Unit: mm) FEATURES 特長 • Miniature size: 2012 footprint (2.0mmx1.2mm) and low profile(1.0mm Max. Height)  Magnetically shielded

MDT2012-CR

Contextual Info: Multilayer Power Inductors 積層パワーインダクタ MDT2012-CR Recommended patterns 推奨パターン図 Unit: mm FEATURES 特長 • Miniature size: 2012 footprint (2.0mmx1.2mm) and low profile(1.0mm max. Height)  Magnetically shielded  Ideal for a variety of DC-DC converter Inductor application

MDT2012CH2R2

Contextual Info: Multilayer Power Inductors 積層パワーインダクタ MDT2012-CH Recommended patterns 推奨パターン図 Unit: mm FEATURES 特長 • Miniature size: 2012 footprint (2.0mmx1.2mm) and low profile(1.0mm max. Height)  Magnetically shielded  Ideal for a variety of DC-DC converter Inductor application

GLF Series

Abstract: GLF1608 GLF2125 150M GLF3216
Contextual Info: Cal-Chip Electronics, Incorporated GLF SERIES Multilayer Chip Inductors FEATURES • Internal printed coil structure creates a closed magnetic circuit which acts as a magnetic shield eliminating cross talk, thus permitting higher mounting densities. • Multilayer block structure yields higher reliability.

GLF3216

Contextual Info: Cal-Chip Electronics, Incorporated GLF SERIES Multilayer Chip Inductors FEATURES • Internal printed coil structure creates a closed magnetic circuit which acts as a magnetic shield eliminating cross talk, thus permitting higher mounting densities. • Multilayer block structure yields higher reliability.

2r5 COIL FOR LAPTOP

Abstract: R20-R30 DXM-1306
Contextual Info: DXM Series of High Efficiency Power Inductors New series of inductors provide high current capability for switching power supplies and portable electronics Tyco Electronics announces the new DXM series of lead-free power inductors from their CoEv Magnetics business unit.

Contextual Info: KENLOTT ELECTRONICS CO., LTD. FLAT M, 8/F, HOUSTON IND. BLDG., 32-40 WANG LUNG STREET, TSUEN WAN, N. T., HONG KONG. TEL : 852 2408-2202 FAX : (852) 2408-2723 MULTILAYER CHIP INDUCTORS FEATURE 1 MINIMUM DIMENSIONS FOR AN INDUCTOR. 2 NO CROSSTALK BETWEEN INDUCTORS DUE TO MAGNETIC SHIELD.PERFECT FOR HIGH DENSITY INSTALLATION.

Contextual Info: Multilayer Ferrite Chip Inductor－ML Series •Construction 3 2 1 1 Ferrite 2 Internal Electrode 3 Electrode Plating Ag/Ni/Sn ■Dimensions ■Features －Closed magnetic circuit avoids crosstalk －Suitable for high density installation and re-flow soldering

5r6 inductor

Abstract: HP16193A HP4291A CIL21NR22 CIL21Y120
Contextual Info: CIL Series Ordinary Type It has ferrite and 100% Ag as internal conductors, the CIL Series has excellent Q characteristics and eliminate crosstalk. FEATURES Magnetic shielding eliminates crosstalk, thus permitting higher mounting densities. Excellent solderability and high heat resistance for either flow or reflow soldering.

Contextual Info: Chip Inductor; CIL Series General Type Feature Magnetic shielding eliminates crosstalk, thus permitting higher mounting density. Excellent solderability and high heat resistance for either flow or reflow soldering. Monolithic structure for high reliability.

MIC1206B

Abstract: 0805D
Contextual Info: T Y P E M I C FEATURES_ SMEC offers a product that utilizes a unique technology to provide a Surface Mounted Chip Inductor, that is unlike any coil type inductor. Magnetic materials technology and multilayer technology is used to

Contextual Info: Multilayer Ferrite Chip Inductor CFB Series MERITEK RoHS FEATURES •   Closed magnetic circuit avoids crosstalk Suitable for high density installation and re-flow soldering Sizes 0603 / 0805 / 1206 APPLICATIONS      Personal Computers

MHCC06030-100M-R7

Abstract: MHCC10040-1R0M-R7 mhcc10040 MHCI06030-4R7M-R8 MHCC12050-R47M-R7 MHCI06030-R47M-R8 MHCI10040-4R7M-R8 MHCI06030-1R0M-R8 MHCI06030-1R5M-R8 mhci06030
Contextual Info: Molding Power Choke – MHCC,MHCI Series MHCCMHCI Series MHCC series is designed for low profile type with low RDC and ultra large current. Its molded magnetic shielded type is suitable for high-density mounting and ultra low buzz noise. Soldering conditions

6003R3

Contextual Info: Multilayer Ferrite Chip Inductor CFB Series MERITEK RoHS FEATURES •   Closed magnetic circuit avoids crosstalk Suitable for high density installation and re-flow soldering Sizes 0603 / 0805 / 1206 APPLICATIONS      Personal Computers

Contextual Info: 【ML Series】 Multilayer Ferrite Chip Inductor •Features －Closed magnetic circuit avoids crosstalk －Suitable for high density installation and re-flow soldering －Sizes 0603 / 0805 / 1206 ■Applications －Personal Computers －Portable Equipment