QFP64 PACKAGE Search Results

teletext

Abstract: QFP64 SAA5246A teletext decoder SAA5249 caption QFP64 package DIP40 DIP48 SAA5252
Contextual Info: INTEGRATED CIRCUITS DATA SHEET Selection table for teletext and closed caption 1996 Sep 19 File under Integrated Circuits, IC22 1996 Sep 19 2 − All WST All WST By region FCC compliant By region All WST LANGUAGE/REGION QFP64 or DIP48 PACKAGE QFP64 or DIP40

QFP64

Abstract: QFP-64
Contextual Info: Philips Semiconductors Package outlines QFP64: plastic quad flat package; 64 leads lead length 2.35 mm ; body 14 x 20 x 2.75 mm 1995 Feb 04 5-22 SOT208-1

QFP64 package

Abstract: QFP64-B2
Contextual Info: PACKAGE DIMENSIONS QFP64-B2 17.2±0.4 ~ 10º 14.0±0.3 49 32 64 17 1 17.2 ±0.4 33 14.0 ±0.3 48 0.15 M 16 0.35±0.1 +0.1 0.15 - 0.05 3.05MAX 0.8 0.8±0.2 0.15 +0.1 0.1 - 0.05 Mold Base UNIT : mm

QFP64 package

Abstract: D1 Package
Contextual Info: PACKAGE DIMENSIONS QFP64-D1 12.0±0.4 0 ~ 10º 10.0±0.3 32 64 17 10.0±0.3 49 16 0.2±0.05 0.15 1.75±0.1 0.5 M 2.05M AX 1 +0.1 0.15 - 0.05 12.0±0.4 33 48 0.5±0.2 0.1±0.1 Mold Base UNIT : mm

QFP64 package

Abstract: QFP64-C1
Contextual Info: PACKAGE DIMENSIONS QFP64-C1 25.6±0.4 20.0±0.3 64 20 1 19.6 ±0.4 32 2.7±0.1 52 14.0±0.3 33 3.0MAX 51 ~ 10º 19 0.4 +0.15 -0.1 0.12 M 0.15 +0.1 - 0.05 1.0 1.6±0.2 0.15 0.1±0.1 Mold Base UNIT : mm

diode b3

Abstract: QFP64 package QFP64-B3
Contextual Info: PACKAGE DIMENSIONS QFP64-B3 0 ~ 12° 16.8±0.4 14.0±0.3 48 32 64 17 14.0±0.3 49 1 16.8±0.4 33 16 0.35±0.15 0.16 M +0.1 0.15 - 0.05 3.0MAX 0.8 0.6±0.3 0.15 +0.1 0.1 - 0.05 Mold Base UNIT : mm

QFP64-G1

Abstract: QFP64 package
Contextual Info: PACKAGE DIMENSIONS QFP64-G1 0~10° 16.0±0.4 14.0±0.3 33 32 64 17 14.0±0.3 49 16.0±0.4 48 16 0.35±0.1 0.12 +0.1 0.15 - 0.05 1.4±0.1 0.8 M 1.7MAX 1 0.5 0.10 +0.1 0.1 - 0.05 Mold Base UNIT : mm

QFP64 package

Abstract: QFP64-C2
Contextual Info: PACKAGE DIMENSIONS QFP64-C2 23.9±0.4 20.0±0.3 64 20 1 17.9±0.4 32 2.7±0.1 52 14.0±0.3 33 3.0M AX 51 ~ 10º 19 +0.15 0.4 - 0.1 +0.1 0.15 - 0.05 1.0 0.12 M 0.8±0.2 0.15 0.1±0.1 Mold Base UNIT : mm

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP64 package SOT393-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

diode k1

Contextual Info: PACKAGE DIMENSIONS QFP64-K1 12.0 ±0.2 0 ~ 10ﾟ 10.0TYP 32 64 17 10.0TYP 49 12.0 ± 0.2 33 48 16 1 0.2 ± 0.10 0.08 M 0.17 ± 0.05 1.70MAX 0.5 0.5 ±0.2 GD-Q06401Y-1 Ver.2005-11-22 0.1 ± 0.1 Mold Base UNIT : mm

Contextual Info: TO SH IB A TMP93CS32 Low Voltage / Low Power CMOS 16-bit Microcontrollers TMP93CS32F 1. Outline and Device Characteristics The TMP93CS32 is high-speed, advanced 16-bit microcontroller developed for controlling medium to large-scale equipment. The TMP93CS32 is housed in 64-pin flat package P-QFP64-1414-0.80A .

QFP64-H1

Abstract: QFP64 package
Contextual Info: PACKAGE DIMENSIONS QFP64-H1 PRELIMINARY 12.0±0.2 0 ~ 10° 10.0±0.2 32 64 17 10.0±0.2 0.2±0.1 0.08 1.4±0.2 +0.1 0.15- 0.05 M Mold Base 0.1 11.0±0.2 +0.15 0.1- 0.1 1.25TYP 0.5 0.5±0.2 16 1 1.85MAX 1.25TYP 49 12.0±0.2 33 48 UNIT : mm

QFP64 package

Abstract: QFP80-P-1420-0 TLCS-900 TMP96C031Z LSI CMOS Technology TMP96C031
Contextual Info: TOSHIBA PACKAGE 80 Pin QFP Flat Package PACKAGE N A M E: QFP80-P-1420-0.80B CM PKG900-1 TOSHIBA 64 Pin FP (Flat Package) PACKAGE : For TMP96C031Z Package Name :QFP64-P-1420-1.00A o X Unit : mm r\ n CM 270289 PKG900-2 TOSHIBA TLCS-900 USER'S MANUAL POSTSCRIPT

PRQP0064GA-A

Contextual Info: JEITA Package Code P-QFP64-14x14-0.80 RENESAS Code PRQP0064GA-A Previous Code 64P6N-A MASS[Typ.] 1.1g HD *1 D 48 33 49 HE NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. *2 E 32 16 c Index mark F

QFP64 package

Abstract: QFP64-N1
Contextual Info: PACKAGE DIMENSIONS QFP64-N1 12.0 ± 0.1 0 to 10° 10.0 ± 0.1 32 64 17 10.0 ± 0.1 49 12.0 ± 0.1 33 48 16 1 0.5 0.2 ± 0.1 1.6 M AX 0.15 TYP 1.4 ± 0.05 0.076 0.6 ± 0.1 0.1 ± 0.05 Mold Base UNIT : mm Ver.2008-04-09

QFP64 package

Abstract: PRQP0064GB-A P-QFP64-14x14-0
Contextual Info: JEITA Package Code P-QFP64-14x14-0.80 RENESAS Code PRQP0064GB-A Previous Code FP-64A/FP-64AV MASS[Typ.] 1.2g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 48 33 32 49 bp c c1 HE *2 E b1 Reference

QFP64-H1

Contextual Info: PACKAGE DIMENSIONS QFP64-H1 12.0±0.2 0 ~ 10° 10.0±0.2 32 64 17 10.0±0.2 0.2±0.1 0.08 1.4±0.2 +0.1 0.15- 0.05 1.25TYP 0.5 M 0.5±0.2 16 1 1.85MAX 1.25TYP 49 12.0±0.2 33 48 Mold Base +0.15 0.1- 0.1 0.1 11.0±0.2 UNIT : mm Ver.2003-08-29

QFP64-P-1414-0

Abstract: SDIP64-P-750-1 3804 f
Contextual Info: APPENDIX 3.6 Package outline 3.6 Package outline 64P6N-A Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code – HD 64 b2 ME D 49 1 I2 48 Recommended Mount Pad HE E Symbol 33 16 A 32 L1

QFP64-P-1414-0

Abstract: SDIP64-P-750-1
Contextual Info: APPENDIX 3.6 Package outline 3.6 Package outline 64P6N-A Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code – HD 49 b2 64 ME D 1 48 I2 HE E Recommended Mount Pad Symbol A A1 A2 b c D

TT 2222

Abstract: TMP95C063F QFP100-P-2222-0 tmp95c061bf QFP 144 PACKAGE QFP144 QFP64 package QFP100-P-1414-0 QFP64-P-1414-0 TMP95C001F
Contextual Info: TO SHIBA PACKAGE 64 pin QFP : fo r TMP95C001F PACKAGE NAME : QFP64-P-1414-0.80A Unit. mm 17.210.2 14.010.2 F'~ T3= i32 '49' "TI*1"'"! ^*”11' o 64 & CM CM $ TÍ CM S 17 16 1.0TYP 0.3510.1 4H0.16Çm | CM- $ r-« «Ä CM in L-M o.1 15.610.2 PKG900-1 ? .X .

DM-28

Contextual Info: TO SH IB A TMP93CS32 Low Voltage / Low Pow er CM OS 16-bit Microcontrollers TMP93CS32F 1. Outline and Device Characteristics The TM P9 3C S32 is high-speed, advanced 16-bit m icrocontroller developed for controlling m edium to large-scale equipm ent. The TM P9 3C S32 is housed in 64-pin fla t package P-QFP64-1414-0.80A .

Contextual Info: TOSHIBA TMP93CS32 Low Voltage / Low Pow er CM OS 16-bit Microcontrollers TM P93C S3 2F 1. O utline and Device Characteristics The TM P9 3C S32 is high-speed, advanced 16-bit m icrocontroller developed for controlling m edium to large-scale equipm ent. The TM P9 3C S32 is housed in 64-pin fla t package P-QFP64-1414-0.80A .

QFP64 package

Abstract: QFP64-N1
Contextual Info: PACKAGE DIMENSIONS QFP64-N1 12. 0 ± 0. 1 0 t o 10° 10. 0 ± 0. 1 32 64 17 10. 0 ± 0. 1 49 12. 0 ± 0. 1 33 48 16 1 0. 5 0. 2 ± 0. 1 1. 6 MAX 0. 15 TYP 1. 4 ± 0. 05 0. 076 MI N 0. 6 ± 0. 1 0. 1 ± 0. 05 Mol d Base UNIT : mm

Contextual Info: Package outline QFP64: plastic quad flat package; 64 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT319-2 c y X 51 A 33 52 32 ZE e A E HE A2 (A 3) A1 θ wM pin 1 index Lp bp L 20 64 detail X 19 1 ZD w M bp e v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)