QFP64 PACKAGE Search Results

teletext

Abstract: QFP64 SAA5246A teletext decoder SAA5249 caption QFP64 package DIP40 DIP48 SAA5252
Contextual Info: INTEGRATED CIRCUITS DATA SHEET Selection table for teletext and closed caption 1996 Sep 19 File under Integrated Circuits, IC22 1996 Sep 19 2 − All WST All WST By region FCC compliant By region All WST LANGUAGE/REGION QFP64 or DIP48 PACKAGE QFP64 or DIP40

QFP64

Abstract: QFP-64
Contextual Info: Philips Semiconductors Package outlines QFP64: plastic quad flat package; 64 leads lead length 1.95mm ; body 14 x 20 x 2.8 mm 1995 Feb 04 3092 SOT319-2

QFP64

Abstract: QFP-64
Contextual Info: Philips Semiconductors Package outlines QFP64: plastic quad flat package; 64 leads lead length 2.35 mm ; body 14 x 20 x 2.75 mm 1995 Feb 04 5-22 SOT208-1

qfp64

Abstract: QFP-64 sot208-1 14X20
Contextual Info: Philips Semiconductors Package outlines QFP64: plastic quad flat package; 64 leads lead length 2.35 mm ; body 14 x 20 x 2.75 mm 1995 Feb 04 SOT208-1

QFP64-P-1414

Contextual Info: QFP64-P1414-0.80-BK 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.87 TYP. 5/Sept.21,1999

Contextual Info: QFP64-P-1414-0.80-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.87 TYP. 6/Feb. 23, 2001

Contextual Info: QFP64-P-1420-1.00-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.25 TYP. 4/Nov. 28, 1996

QFP80-P-1420-0

Abstract: TMP96C031Z QFP80-P
Contextual Info: TOSHIBA 64 Pin FP Flat Package Package : For TMP96C031Z Package Name :QFP64-P-1420-1.00A o X Unit r\ n mm (VI 270289 PKG900-2 TOSHIBA Package 80 Pin QFP (Flat Package) Package Name: QFP80-P-1420-0.80B CM PKG900-1

QFP64 package

Abstract: QFP64-B2
Contextual Info: PACKAGE DIMENSIONS QFP64-B2 17.2±0.4 ~ 10º 14.0±0.3 49 32 64 17 1 17.2 ±0.4 33 14.0 ±0.3 48 0.15 M 16 0.35±0.1 +0.1 0.15 - 0.05 3.05MAX 0.8 0.8±0.2 0.15 +0.1 0.1 - 0.05 Mold Base UNIT : mm

QFP64 package

Abstract: D1 Package
Contextual Info: PACKAGE DIMENSIONS QFP64-D1 12.0±0.4 0 ~ 10º 10.0±0.3 32 64 17 10.0±0.3 49 16 0.2±0.05 0.15 1.75±0.1 0.5 M 2.05M AX 1 +0.1 0.15 - 0.05 12.0±0.4 33 48 0.5±0.2 0.1±0.1 Mold Base UNIT : mm

QFP64 package

Abstract: QFP64-C1
Contextual Info: PACKAGE DIMENSIONS QFP64-C1 25.6±0.4 20.0±0.3 64 20 1 19.6 ±0.4 32 2.7±0.1 52 14.0±0.3 33 3.0MAX 51 ~ 10º 19 0.4 +0.15 -0.1 0.12 M 0.15 +0.1 - 0.05 1.0 1.6±0.2 0.15 0.1±0.1 Mold Base UNIT : mm

HC49

Abstract: QFP64 GOAL SEMICONDUCTOR
Contextual Info: VMX1020-C16/I16 VERSA MIX System Design Notes Description This application note is intended to provide hands-on information about the hardware requirements for a VERSA MIX based system. VMX1020 Pin configuration The VMX1020 is available in standard QFP64 package.

QFP80-P-1420-0

Abstract: 80H-F
Contextual Info: TOSHIBA 8 0 h f> Q F P Flat Package mm QFP80-P-1420-0.80B (N PKG900-1 TOSHIBA /\"7 > r - v - ! 64 tf > QFP (Flat Package) QFP64-P-1420-1.00A : mm o o o 4. n o (N PKG900-2

diode b3

Abstract: QFP64 package QFP64-B3
Contextual Info: PACKAGE DIMENSIONS QFP64-B3 0 ~ 12° 16.8±0.4 14.0±0.3 48 32 64 17 14.0±0.3 49 1 16.8±0.4 33 16 0.35±0.15 0.16 M +0.1 0.15 - 0.05 3.0MAX 0.8 0.6±0.3 0.15 +0.1 0.1 - 0.05 Mold Base UNIT : mm

QFP64-P-1420-1

Abstract: QFP-64P
Contextual Info: QFP64-P-1420-1.00-BK Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

QFP64-G1

Abstract: QFP64 package
Contextual Info: PACKAGE DIMENSIONS QFP64-G1 0~10° 16.0±0.4 14.0±0.3 33 32 64 17 14.0±0.3 49 16.0±0.4 48 16 0.35±0.1 0.12 +0.1 0.15 - 0.05 1.4±0.1 0.8 M 1.7MAX 1 0.5 0.10 +0.1 0.1 - 0.05 Mold Base UNIT : mm

QFP64 package

Abstract: QFP64-C2
Contextual Info: PACKAGE DIMENSIONS QFP64-C2 23.9±0.4 20.0±0.3 64 20 1 17.9±0.4 32 2.7±0.1 52 14.0±0.3 33 3.0M AX 51 ~ 10º 19 +0.15 0.4 - 0.1 +0.1 0.15 - 0.05 1.0 0.12 M 0.8±0.2 0.15 0.1±0.1 Mold Base UNIT : mm

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP64 package SOT393-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: Adapters - Phyton, Inc. Page 1 of 1 Device Programmers and Development Tools for Microcontrollers Home Quick Links Help Desk Products E-Shop Support Contact News Site Map AE-Q64-XMEGA Downloads All Programmers DIP40/QFP64 specialized adapter for Atmel AVR microcontrollers.

diode k1

Contextual Info: PACKAGE DIMENSIONS QFP64-K1 12.0 ±0.2 0 ~ 10ﾟ 10.0TYP 32 64 17 10.0TYP 49 12.0 ± 0.2 33 48 16 1 0.2 ± 0.10 0.08 M 0.17 ± 0.05 1.70MAX 0.5 0.5 ±0.2 GD-Q06401Y-1 Ver.2005-11-22 0.1 ± 0.1 Mold Base UNIT : mm

Contextual Info: TO SH IB A TMP93CS32 Low Voltage / Low Power CMOS 16-bit Microcontrollers TMP93CS32F 1. Outline and Device Characteristics The TMP93CS32 is high-speed, advanced 16-bit microcontroller developed for controlling medium to large-scale equipment. The TMP93CS32 is housed in 64-pin flat package P-QFP64-1414-0.80A .

Contextual Info: Adapters - Phyton, Inc. Page 1 of 1 Device Programmers and Development Tools for Microcontrollers Home Quick Links Help Desk Products E-Shop Support Contact News Site Map AE-Q64-HCS08-2 Downloads All Programmers DIP40/QFP64 specialized adapter for Motorola/Freescale microcontrollers.

Contextual Info: Adapters - Phyton, Inc. Page 1 of 1 Device Programmers and Development Tools for Microcontrollers Home Quick Links Help Desk Products E-Shop Support Contact News Site Map AE-Q64-HCS08-1 Downloads All Programmers DIP40/QFP64 specialized adapter for Motorola/Freescale microcontrollers.

QFP64-H1

Abstract: QFP64 package
Contextual Info: PACKAGE DIMENSIONS QFP64-H1 PRELIMINARY 12.0±0.2 0 ~ 10° 10.0±0.2 32 64 17 10.0±0.2 0.2±0.1 0.08 1.4±0.2 +0.1 0.15- 0.05 M Mold Base 0.1 11.0±0.2 +0.15 0.1- 0.1 1.25TYP 0.5 0.5±0.2 16 1 1.85MAX 1.25TYP 49 12.0±0.2 33 48 UNIT : mm