QFP48 PACKAGE Search Results

QFP48

Abstract: qfp-48
Contextual Info: Philips Semiconductors Package outlines QFP48: plastic quad flat package; 48 leads lead length 2.5 mm ; body 10 x 10 x 1.75 mm 1995 Feb 04 1 SOT196-1

Contextual Info: Adapters - Phyton, Inc. Page 1 of 2 Device Programmers and Development Tools for Microcontrollers Home Quick Links Help Desk Downloads All Programmers Products E-Shop Support Contact News Site Map AE-Q48-F387 DIP40/QFP48 specialized adapter for Fujitsu microcontrollers.

Contextual Info: Adapters - Phyton, Inc. Page 1 of 1 Device Programmers and Development Tools for Microcontrollers Home Quick Links Help Desk Products E-Shop Support Contact News Site Map AE-Q44-XMEGA Downloads All Programmers DIP40/QFP48 specialized adapter for Atmel microcontrollers.

Contextual Info: AE-Q48U Page 1 of 2 AE-Q48U DIP48/QFP48 universal adapter. Device package dimensions: body - 7.0 x 7.0 x 1.5 mm, body with pins - 9.0 x 9.0 mm, 0.5 mm pitch. Click the programmer model below to get an appropriate list of the devices supported by the adapter:

Contextual Info: Adapters - Phyton, Inc. Page 1 of 2 Device Programmers and Development Tools for Microcontrollers Home Quick Links Help Desk Downloads All Programmers Products E-Shop Support Contact News Site Map AE-Q48-W79-3 DIP40/QFP48 specialized adapter for Nuvoton/Winbond microcontrollers.

PQFP-48

Abstract: QFP48 package QFP48 PRQP0048JA-A
Contextual Info: JEITA Package Code P-QFP48-7x10-0.65 RENESAS Code PRQP0048JA-A Previous Code 48P6S-A MASS[Typ.] 0.3g HD *2 D 25 38 39 E *1 HE 24 ZE NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 48 15 Reference

QFP48 package

Abstract: QFP48 QFP48-J1
Contextual Info: PACKAGE DIMENSIONS QFP48-J1 9.0±0.3 0 - 10° 7.0±0.2 0.75TYP 36 25 7.0±0.2 13 1 0.5 0.2±0.1 1.45±0.1 +0.1 0.15 - 0.05 Ver.2003-08-29 0.08 M 0.10 0.1±0.05 Mold Base 0.5±0.2 GD-Q04801P-0 12 1.55±0.15 0.75TYP 48 9.0±0.3 24 37 UNIT : mm

QFP48

Abstract: QFP48 package QFP48-P1
Contextual Info: PACKAGE DIMENSIONS QFP48-P1 16.0±0.3 0 - 10° 25 24 48 15 10.0±0.2 39 1 1.8TYP 14 0.35±0.1 +0.1 0.15 - 0.05 M +0.1 0.1 - 0.05 Mold Base 0.15 Ver.2003-08-29 0.16 2.7±0.2 0.8 0.45±0.2 GD-Q04801T-0 12.0±0.3 38 3.1MAX 1.4TYP 14.0±0.2 UNIT : mm

JEDEC tray standard

Abstract: QFP48-P-0707 QFP48 package QFP32-P-0707 QFP48
Contextual Info: Product Change Notification Type of Notification: ISSUE DATE LAST BUY DATE NOTIFICATION NO. LAST SHIP DATE March 23, 2005 NA 20050323-03 March, 2005 This is to advise you that the following product s have been discontinued. Product ID (Description): Tray change for all IC’s that are packaged in QFP32-P-0707 and QFP48-P-0707package.

QFP48 package

Contextual Info: 48P6S-A Plastic 48pin 7✕10mm body QFP EIAJ Package Code QFP48-P-710-0.65 Weight g 0.29 Lead Material Alloy 42 MD e JEDEC Code – HD D ME 39 b2 48 1 38 I2 Symbol HE E Recommended Mount Pad 25 14 15 A 24 c A2 L1 F b y x M A1 e Detail F L A A1 A2 b c D E

QFP48

Abstract: QFP48 package
Contextual Info: 48P6S-A Plastic 48pin 7✕10mm body QFP EIAJ Package Code QFP48-P-710-0.65 Weight g 0.29 JEDEC Code – Lead Material Alloy 42 MD e HD D 39 1 b2 ME 48 38 I2 HE E Recommended Mount Pad Symbol 25 14 15 A 24 b y F A1 e c A2 L1 Detail F L A A1 A2 b c D E e HD

qfp48

Abstract: QFP48 package QFP48 DIMENSIONS
Contextual Info: PACKAGE DIMENSIONS QFP48-R2 9.0 ±0. 2 0 ～8 ° +0.40 7. 0 -0.10 36 25 +0. 40 7.0 -0. 10 48 13 12 1 0.2 ±0. ０ ５ 0. 08 M +0.2 0 1.5 0 -0.1 0 0.14 5 ±0 .055 Mold Bas e 0 .60 ±0.15 0 .08 0.1 0 ±0 .10 0 .5 9. 0 ±0 .2 24 37 UNIT : mm Ver.2005-08-26

QFP48 package

Abstract: QFP48-N2 QFP48
Contextual Info: PACKAGE DIMENSIONS QFP48-N2 9 . 0 ±0 . 3 7 .0 ±0 .2 0 ~10ﾟ 25 36 24 0.75 TYP 7 . 0 ±0 . 2 9. 0 ±0. 3 37 48 13 0.75 TYP 12 0 . 2 2 ±0 . 05 0 . 1 5 + 0. 0 5 -0 . 0 6 1 .0 0 ±0. 1 0.50 0.08 M 1.25 MA X 1 0 . 6 ±0 . 2 0 .0 8 0 . 1 ±0 . 0 5 Mold Base

QFP48 package

Abstract: QFP48 QFP48-P1
Contextual Info: PACKAGE DIMENSIONS QFP48-P1 16. 0 ± 0. 3 0 t o 10° 38 25 24 48 15 10. 0 ± 0. 2 39 12. 0 ± 0. 3 1. 4TYP 14. 0 ± 0. 2 1 0. 35 ± 0. 1 0. 16 + 0. 1 0. 15 - 0. 05 2. 7 ± 0. 2 0. 8 M 3. 1 MAX 1. 8TYP 14 0. 45 ± 0. 2 0. 15 + 0. 1 0. 1 - 0. 05 Mol d Base UNIT : mm

OV10620

Abstract: OV10121-Q48V omnivision FSIN omnivision CMOS sensor omnivision omnivision* Sccb omnivision CMOS sensor automotive QFP48 DIMENSIONS OV*620 RGB565
Contextual Info: OV10620 HDR product brief available in a lead-free package high dynamic range, high-quality, single-chip video/imaging automotive camera sensor The OV10620 is a high-performance color or b&w CMOS CameraChip image sensor with High Dynamic Range HDR designed specifically for automotive applications.

IRMCF171

Abstract: IRMCS1271 IRMCS1671 IRMCF143 power wizard 1.0 module power wizard 1.0 module control IRAMX16UP60A IRMCK171 IRAM136-1061A IRMCS1043
Contextual Info: MOTION CONTROL MOTION Integrated Design Platform THE POWER MANAGEMENT LEADER Digital Control ICs IR’s iMOTION Integrated Design Platform delivers everything you need to design a complete variable Part Number Package speed motor control subsystem. From the front

QFP48

Abstract: QFP48 package NJU26200V NJU26200 NJU26200FN2 NJU26201 NJU26249 SSOP44 NJU26220
Contextual Info: NJU26200 Series NJU26200 Series Hardware Specification • General Description ■Package This document describes the NJU26200 Series common hardware specifications. This document is applied to the NJU26201 up to the NJU26249. The individual function is described in the each data sheet. Please refer to the

2x16K

Abstract: AT91SAM9G25 AT91SAM9G BGA324 SAM9G25 SD-Card MMC ATMEL QFP128 BGA217 AT91SAM7S-EK* LCD sam3s4c
Contextual Info: Atmel Evaluation Kits Ordering Code Supported Device ATSAM3N-EK SAM3N4, SAM3N2, SAM3N1 ATSAM3S-EK SAM3S4, SAM3S2, SAM3S1 ATSAM3U-EK SAM3U4, SAM3U2, SAM3U1 AT91SAM7L-STK SAM7L64, SAM7L128 AT91SAM7S-EK SAM7S16, SAM7S32, SAM7S64, SAM7S256, SAM7S161, SAM7S321,

QFP48

Abstract: C8051F700 8051 spi qfn48 spi 3 wire TQFP48 TQFP64 C8051F715-GM 24 BIT adc spi FPGA Silicon Labs
Contextual Info: C8051F700 Serial Peripheral Interface SPI Overview Agenda • C8051F700 block diagram • C8051F700 device features  SPI operation overview  SPI module overview  Where to learn more 2 Introducing The C8051F700  New patented capacitive touch sense

high level block diagram for eeprom

Abstract: C8051F700 8051 spi eeprom EEPROM Silabs 8051 interfacing to EEProm qfn48 QFP48 QFP48 package TQFP48
Contextual Info: C8051F700 EEPROM Module Overview 1 Agenda • C8051F700 block diagram • C8051F700 device features  EEPROM module overview  Where to learn more 2 We are going to look at the new C8051F700 devices in this module. We will first take a look at the high level block diagram and then dive into the EEPROM

NJM2700FJ1

Contextual Info: NJM2700 SRS WOW AUDIO PROCESSOR •GENERAL DESCRIPTION The NJM2700 is a SRS WOW audio processor, based on the technology of SRS Labs, Inc. The NJM2700 reproduces wide and clear sound. In addition, it provides rich bass sound. The NJM2700 is suitable for speaker system for

OF VR 10K

Contextual Info: NJM2700 SRS WOW AUDIO PROCESSOR •GENERAL DESCRIPTION The NJM2700 is a SRS WOW audio processor, based on the technology of SRS Labs, Inc. The NJM2700 reproduces wide and clear sound. In addition, it provides rich bass sound. The NJM2700 is suitable for speaker system for

J15-12

Contextual Info: Atmel AVR32025: AT32UC3L-EK User Guide Features • • • • • Kit features overview Kit content Hardware description Schematics Errata 32-bit Atmel Microcontrollers Application Note 1 Introduction The Atmel AT32UC3L-EK is an evaluation kit and development system for the

QFP48 package

Abstract: QFP48 NJU26201 NJU26249 SSOP44 NJU26200 NJU26200FR3 NJU26200V no17p
Contextual Info: NJU26200 Series NJU26200 Series Hardware Specification • General Description ■Package This document describes the NJU26200 Series common hardware specifications. This document is applied to the NJU26201 up to the NJU26249. The individual function is described in the each data sheet. Please refer to the